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VD0544 Copper Evaporation Materials, Cu

Material Type: Copper
Symbol: Cu
Atomic Number: 29
Color/Appearance: Copper, Metallic
CAS Number: 7440-50-8
Purity: 99.9% ~ 99.999%

TFM is a leading provider of high-purity copper evaporation materials, offering an extensive range of products for various applications. As a top manufacturer and supplier, we provide copper materials in powder, granule, and custom forms tailored to meet your specific needs. Our diverse selection ensures that we can support a wide array of evaporation processes.

MSDS File

Copper Evaporation Materials Description

High-purity copper evaporation materials are critical for achieving high-quality films in deposition processes. Copper, known for its reddish-orange color, has a melting point of 1,083°C, a density of 8.92 g/cm³, and a vapor pressure of 10⁻⁴ Torr at 1,017°C. As a key component in popular alloys like brass and bronze, copper is renowned for its exceptional conductivity of heat and electricity. It is widely used in applications such as wiring, coins, and electromagnets.

TFM specializes in producing copper evaporation materials with up to 99.99% purity. Our rigorous quality assurance processes ensure that our products are reliable and meet the highest standards for performance.

copper evaporation materials

Copper Evaporation Materials Specification

Material TypeCopper
SymbolCu
Color/AppearanceCopper, Metallic
Melting Point1,083 °C
Thermal Conductivity400 W/m.K
Density8.92 g/cc
SynonymsCu Pellets, Cu Pieces, Cu Evaporation Pellet, Copper Pellets, Copper Pieces, Copper Evaporation Pellet

Copper Evaporation Materials Applications

Copper evaporation materials are widely utilized in deposition processes, including semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). In the field of optics, they are employed for various applications, such as wear protection, decorative coatings, and display technologies. Their high purity and excellent conductivity make them essential for achieving precise and durable results in these advanced applications.

Copper Evaporation Materials Packing

We handle our copper evaporation materials with meticulous care to avoid any damage during storage and transportation. This ensures that the materials retain their original quality and performance when they reach you.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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