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Copper Evaporation Materials Copper Pellets Cu 99.999%

VD0544 Copper Evaporation Materials, Cu

Material Type: Copper
Symbol: Cu
Atomic Number: 29
Color/Appearance: Copper, Metallic
CAS Number: 7440-50-8
Purity: 99.9% ~ 99.999%

TFM is a leading provider of high-purity copper evaporation materials, offering an extensive range of products for various applications. As a top manufacturer and supplier, we provide copper materials in powder, granule, and custom forms tailored to meet your specific needs. Our diverse selection ensures that we can support a wide array of evaporation processes.

MSDS File

Copper Evaporation Materials

Copper Evaporation Materials

Introduction

Copper evaporation materials are widely used in thin film deposition processes due to copper’s excellent electrical conductivity, thermal conductivity, and adhesion properties. These materials are indispensable in industries such as semiconductors, data storage, optics, and energy devices, where high-quality copper films are required to ensure performance and reliability.

Detailed Description

Our copper evaporation materials are produced using high-purity copper refined through advanced vacuum melting and shaping processes. The materials are available in multiple forms, including pellets, shots, granules, wires, and custom-shaped pieces, designed to suit various evaporation systems.

The purity of copper (typically 99.9%–99.999%) directly affects the conductivity and uniformity of thin films, making it critical for demanding applications. Shape and size uniformity are carefully controlled to ensure stable evaporation rates, while optional granule or pellet forms help minimize spitting during heating.

For thermal and electron beam evaporation systems, copper evaporation materials demonstrate stable vapor pressure and consistent deposition behavior, enabling precise control of thin film thickness and microstructure.

Applications

Copper evaporation materials are applied across a broad spectrum of industries, including:

  • Semiconductor fabrication – interconnects, seed layers, and diffusion barriers.

  • Optical coatings – reflective layers in optics and display devices.

  • Data storage – magnetic recording media.

  • Decorative coatings – jewelry, watch components, and architectural finishes.

  • Energy devices – thin film solar cells, batteries, and fuel cells.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.999% (3N–5N)Higher purity ensures conductivity & fewer defects
Forms AvailablePellets, shots, granules, wire, customCompatible with various evaporation sources
Size Range1–20 mm (pellets/granules)Influences evaporation stability
Evaporation MethodThermal / E-beamChoice depends on film requirements
PackingVacuum sealed, inert gas protectedPrevents oxidation and contamination

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Copper (Cu)High conductivity, good adhesionElectronics, optics
Silver (Ag)Highest conductivity, reflectiveMirrors, sensors
Aluminum (Al)Lightweight, cost-effectiveGeneral coatings
Gold (Au)Excellent corrosion resistanceHigh-end electronics, optics

FAQ

QuestionAnswer
Can copper evaporation materials be customized?Yes, forms, sizes, and purity levels can be tailored for specific deposition systems.
What purity levels are available?From 3N (99.9%) to 5N (99.999%) depending on application needs.
How are they packaged?Vacuum-sealed in inert atmospheres with protective containers to avoid oxidation.
What deposition methods are compatible?Suitable for thermal evaporation and electron beam evaporation systems.
Which industries use copper evaporation materials most?Semiconductor, optics, decorative coatings, and renewable energy sectors.

Packaging

Copper evaporation materials are carefully sealed in vacuum or inert gas environments to protect against oxidation. They are labeled with batch numbers, purity grades, and form specifications for traceability. Export packaging includes protective foam and reinforced cartons or wooden crates, ensuring safe transport and storage.

Conclusion

Copper evaporation materials deliver excellent film uniformity, conductivity, and adhesion, making them a reliable choice for advanced thin film deposition. With customizable forms and purities, they meet the diverse needs of research and industry.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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