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Copper Germanium Evaporation Materials

VD0622 Copper Germanium Evaporation Materials, Cu/Ge

Catalog No.VD0622
MaterialCopper Germanium (Cu/Ge)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM excels in manufacturing high-purity copper germanium evaporation materials, adhering to strict quality assurance protocols to ensure consistent product reliability. We offer these materials in a range of forms, including tablets, granules, pellets, and powder, tailored to meet diverse application needs.

MSDS File

Copper Germanium Evaporation Materials Overview

TFM offers top-tier copper germanium evaporation materials, an alloy composed of copper (Cu) and germanium (Ge), designed to deliver exceptional results in deposition processes. With purity levels reaching up to 99.9995%, these materials are crucial for producing high-quality deposited films. Our stringent quality assurance protocols ensure the reliability of every product.

Related Products: Copper Evaporation Materials, Germanium Evaporation Materials

Applications of Copper Germanium Evaporation Materials

TFM’s copper germanium evaporation materials are integral to various high-tech applications, including:

  • Deposition Processes: Widely used in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Applications: Ideal for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our copper germanium evaporation materials are meticulously packaged to protect them from damage during storage and transportation, ensuring they reach you in pristine condition.

Contact Us

As a premier manufacturer and supplier, TFM provides high-purity copper germanium evaporation materials and a broad range of evaporation pellets. We offer these materials in powder, granule, and custom forms upon request. For current pricing and inquiries about other deposition materials not listed, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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