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ST0305 Copper Indium Selenide Sputtering Target, CuInSe2

Chemical Formula: CuInSe2
Catalog Number: ST0305
CAS Number: 12018-95-0
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Copper Indium Selenide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Copper Indium Selenide Sputtering Target Description

A Copper Indium Selenide Sputtering Target is a type of ceramic material composed of copper, indium, and selenium, used in sputtering processes. This target is typically employed in thin film deposition and various specialized applications due to the unique properties of the copper-indium-selenium combination.

CopperCopper is a chemical element with the symbol “Cu” and an atomic number of 29. The name “copper” comes from the Old English word ‘coper,’ derived from the Latin term ‘Cyprium aes,’ meaning metal from Cyprus. Copper has been used since 9000 BC and was discovered by people from the Middle East. It is located in Period 4 and Group 11 of the periodic table, belonging to the d-block elements. The relative atomic mass of copper is approximately 63.546 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Copper Sputtering Target

Indium

Indium is a chemical element with the symbol “In” and an atomic number of 49. The name “indium” is derived from the Latin word ‘indicium,’ meaning violet or indigo, due to its indigo spectral line. It was first mentioned in 1863 by Ferdinand Reich and Theodor Richter, with its isolation later accomplished and announced by Theodor Richter. Indium is located in Period 5 and Group 13 of the periodic table, belonging to the p-block elements. Its relative atomic mass is approximately 114.818 Daltons, with the number in parentheses indicating a margin of uncertainty.

Indium compounds are evaporated under vacuum to form thin films in the production of electronics and photovoltaic cells. Pure indium is used as a film layer in semiconductors.

Related Product: Indium Sputtering Target

SeleniumSelenium is a chemical element with the symbol “Se” and an atomic number of 34. The name “selenium” comes from the Greek word ‘selene,’ meaning moon. It was first mentioned in 1817 and observed by Jöns Jacob Berzelius and Johan Gottlieb Gahn, who also accomplished and announced its isolation. Selenium is located in Period 4 and Group 16 of the periodic table, classified within the p-block elements. Its relative atomic mass is approximately 78.96 Daltons, with the number in parentheses indicating a margin of uncertainty.

Copper Indium Selenide Sputtering Target Application

The Copper Indium Selenide (CIS) Sputtering Target is utilized in a wide range of applications, including thin film deposition and decorative coatings. It is commonly used in the semiconductor industry, display technologies, and the production of LEDs and photovoltaic devices. Additionally, this material is important for functional coatings, optical information storage, glass coating applications for automotive and architectural purposes, and optical communication technologies.

Copper Indium Selenide Sputtering Target Packing

Our Copper Indium Selenide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take extensive precautions to protect these targets from any potential damage during storage and transportation, ensuring they arrive in perfect condition.

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TFM offers Copper Indium Selenide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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