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VD0624 Copper Nickel Evaporation Materials, Cu/Ni

Catalog No.VD0624
MaterialCopper Nickel (Cu/Ni)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM specializes in producing high-purity copper nickel evaporation materials, utilizing rigorous quality assurance processes to ensure product reliability. Our copper nickel materials are available in various forms, including tablets, granules, pellets, and powders, to suit different application needs.

MSDS File

Copper Nickel Evaporation Materials Overview

TFM provides high-purity copper nickel evaporation materials, an alloy composed of copper (Cu) and nickel (Ni). These materials are crucial for deposition processes, ensuring the production of high-quality deposited films. We offer copper nickel materials with purity levels up to 99.9995%, manufactured under stringent quality assurance measures to guarantee exceptional reliability.

Related Products: Copper Evaporation Materials, Nickel Evaporation Materials

Applications of Copper Nickel Evaporation Materials

Copper nickel evaporation materials are versatile and used in various advanced applications:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Uses: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our copper nickel evaporation materials are meticulously managed to prevent any damage during storage and transportation. We ensure that our products maintain their quality throughout their journey to you.

Contact TFM for Copper Nickel Evaporation Materials

As a leading supplier of high-purity copper nickel evaporation materials, TFM offers these products in both powder and granule forms, with custom options available upon request. For current pricing or inquiries about other deposition materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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