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Copper Oxide Sputtering Target

ST0143 Copper Oxide Sputtering Target, CuO

Chemical Formula: CuO
Catalog Number: ST0143
CAS Number: 1317-39-1
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Copper Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Copper Oxide Sputtering Target Description

Copper-II-oxideThe Copper Oxide Sputtering Target from TFM is an oxide sputtering material with the chemical formula CuO. It is a black solid and is one of the two stable oxides of copper, the other being Cu2O, also known as copper (I) oxide or cuprous oxide.

Copper is a chemical element whose name originates from the Old English word “coper,” derived from the Latin ‘Cyprium aes,’ meaning metal from Cyprus. It has been used since as early as 9000 BC and was discovered by people from the Middle East. The chemical symbol for copper is “Cu,” and its atomic number is 29. Copper is located in Period 4, Group 11 of the periodic table, within the d-block. Its relative atomic mass is 63.546(3) Dalton, with the number in brackets indicating the measurement uncertainty. Copper is widely used for its excellent electrical conductivity, thermal conductivity, and corrosion resistance.

Related Product: Copper (Cu) Sputtering Target

Oxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in parentheses indicating the measurement uncertainty. Oxygen is essential for respiration in most life forms and plays a critical role in combustion, oxidation, and various chemical reactions.

Copper Oxide Sputtering Target Specification

Material TypeCopper (II) Oxide
SymbolCuO
Color/AppearanceBlack Solid
Melting Point1,201° C
Density6.31 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Copper Oxide Sputtering Target Handling Notes

  • Indium Bonding: Indium bonding is recommended for the CuO sputtering target due to its brittleness and low thermal conductivity, which make it less suitable for traditional sputtering methods.
  • Thermal Conductivity: This material has low thermal conductivity and is susceptible to thermal shock. Proper handling and bonding are essential to avoid damage during the sputtering process.

Copper Oxide Sputtering Target Application

The Copper Oxide Sputtering Target is used in a variety of applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also essential for functional coatings, the optical information storage industry, glass coatings for automotive and architectural purposes, and optical communication systems, among other fields.

Copper Oxide Sputtering Target Packing

Our Copper Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

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TFM offers Copper Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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