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Copper Selenide Evaporation Materials

VD0845 Copper Selenide Evaporation Materials, CuSe

Catalog No.VD0845
MaterialCopper Selenide (CuSe)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier provider of high-purity copper selenide evaporation materials, along with an extensive range of other evaporation materials. We supply these materials in both powder and granule forms, with custom options available to meet specific needs. Whether you require standard or tailored solutions, our products are designed to support a variety of applications with precision and reliability.

MSDS File

Copper Selenide Evaporation Materials Overview

Copper selenide (CuSe) is a binary inorganic compound composed of copper and selenium. It is a crucial material in various deposition processes, known for its role in creating high-quality films. TFM (Thin-Film Mat Engineering) specializes in providing copper selenide evaporation materials with purity levels reaching up to 99.9995%. These high-purity materials are essential for ensuring the superior quality of deposited films.

Product Specifications

Material TypeCopper selenide
SymbolCuSe
Appearance/ColorCrystalline solid
Melting Point550 °C
Density5.99 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Copper selenide evaporation materials are widely used in various deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are particularly valuable in optics for applications such as wear protection, decorative coatings, and display technologies.

Packaging and Handling

TFM ensures that copper selenide evaporation materials are carefully tagged and labeled for easy identification and quality control. We prioritize secure packaging to prevent any damage during storage and transportation.

Contact Us

As a leading provider of high-purity copper selenide evaporation materials, TFM offers a range of shapes including tablets, granules, rods, and wires. We also accommodate custom requests for specific forms and quantities. In addition, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries on materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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