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Copper Selenide Evaporation Materials

VD0845 Copper Selenide Evaporation Materials, CuSe

Catalog No.VD0845
MaterialCopper Selenide (CuSe)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier provider of high-purity copper selenide evaporation materials, along with an extensive range of other evaporation materials. We supply these materials in both powder and granule forms, with custom options available to meet specific needs. Whether you require standard or tailored solutions, our products are designed to support a variety of applications with precision and reliability.

MSDS File

Introduction

Copper Selenide Evaporation Materials are compound chalcogenide materials widely used in thin film deposition for semiconductor, optoelectronic, and energy-related applications. With well-defined copper–selenium stoichiometry and favorable electronic properties, copper selenide is an important source material for research and production processes involving compound semiconductor and functional thin films.

Detailed Description

Copper selenide evaporation materials are produced from high-purity copper and selenium through carefully controlled synthesis and consolidation processes to ensure accurate stoichiometry and compositional uniformity. Precise control of phase composition—such as Cu₂Se or related Cu–Se phases—is essential, as it directly affects electrical conductivity, carrier concentration, and optical behavior in deposited films.

These materials are supplied in forms suitable for thermal evaporation and electron-beam (e-beam) evaporation, including pellets, granules, and pieces. Optimized particle size and surface condition help ensure smooth melting behavior, stable evaporation rates, and reduced spitting during deposition. Copper selenide evaporation materials are compatible with a wide range of crucibles and liners commonly used in PVD systems.

Customized compositions, forms, and batch sizes are available to support both exploratory laboratory research and repeatable industrial coating processes.

Applications

  • Compound semiconductor thin films

  • Photovoltaic and energy conversion research

  • Optoelectronic and infrared devices

  • Functional chalcogenide coatings

  • Thin film materials research and development

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialCopper Selenide (Cu–Se)Compound semiconductor source
StoichiometryCu₂Se or custom Cu/Se ratioControls electrical & optical properties
Purity99.9% – 99.99%Impurity control affects film quality
FormPellets, granules, piecesCompatible with evaporation sources
Evaporation MethodThermal / E-beam evaporationProcess flexibility
PackagingVacuum-sealed, inert protectedPrevents oxidation & contamination

Comparison with Related Evaporation Materials

MaterialKey AdvantageTypical Application
Copper SelenideBalanced conductivity & band structureSemiconductor & PV films
Copper SulfideStrong optical absorptionPhotovoltaics
Zinc SelenideWide bandgapOptoelectronics & optics

FAQ

QuestionAnswer
Can the Cu/Se ratio be customized?Yes, stoichiometry can be tailored to your deposition requirements.
Is copper selenide suitable for thermal evaporation?Yes, it is commonly used in both thermal and e-beam evaporation systems.
How is compositional uniformity ensured?Through controlled synthesis and strict quality inspection.
How is the material packaged?Vacuum-sealed or packed under inert atmosphere to maintain purity.
Is a Certificate of Analysis available?Yes, CoA is provided upon request.

Packaging

Our Copper Selenide Evaporation Materials are carefully weighed, labeled, and sealed under vacuum or inert atmosphere to protect against oxidation and moisture. Protective inner packaging and export-grade outer cartons ensure safe storage and international transportation.

Conclusion

Copper Selenide Evaporation Materials provide reliable composition control, stable evaporation behavior, and flexible form options for advanced thin film deposition. With consistent quality and customizable specifications, they are well suited for semiconductor, optoelectronic, and energy-focused PVD applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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