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Copper Tin Sputtering Target

ST0494 Copper Tin Sputtering Target, Cu/Sn

Chemical Formula: CuSn
Catalog Number: ST0494
CAS Number: 158113-12-3
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Copper Tin sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Copper Tin Sputtering Target Description

CopperCopper is a chemical element with origins from the Old English word *coper*, derived from the Latin *Cyprium aes*, meaning “metal from Cyprus.” It was used as early as 9000 BC and was discovered by ancient people in the Middle East. Its chemical symbol is “Cu,” and it has an atomic number of 29, located in Period 4 and Group 11 of the periodic table, within the d-block. The relative atomic mass of copper is 63.546(3) Dalton, with the number in brackets indicating the uncertainty.

Tin

Tin, also known as stannum, is a chemical element named after the Anglo-Saxon word *tin* (with *stannum* being the Latin term meaning “hard”). It has been used since around 3500 BC. The chemical symbol for tin is “Sn,” and it has an atomic number of 50, placing it in Period 5 and Group 14 of the periodic table, within the p-block. The relative atomic mass of tin is 118.710(7) Dalton, with the number in brackets indicating the uncertainty.

Related Products: Copper Sputtering Target, Tin Sputtering Target

Copper Tin Sputtering Target Specifications

Material Type Copper Tin
Symbol Cu/Sn
Color/Appearance Metallic solid in various forms including powder, sputtering target, foil, bar, plate
Melting Point /
Density /
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Copper Tin Sputtering Target Application

Copper Tin Sputtering Target is employed for thin film deposition, decoration, and various applications in semiconductor technology, displays, LEDs, and photovoltaic devices. It is also used in functional coatings, optical information storage, and glass coatings for automotive and architectural glass, as well as in optical communication and other related industries.

Packing

Our Copper Tin Sputtering Targets are clearly tagged and labeled for efficient identification and quality control. We take meticulous care to prevent any damage during storage and transportation, ensuring the targets arrive in optimal condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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