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ST0011B Copper Zirconium Sputtering Target

Copper Zirconium Sputtering Target

Introduction

Copper Zirconium (CuZr) Sputtering Target is an alloy material designed for high-performance thin film deposition. By combining copper’s superior electrical and thermal conductivity with zirconium’s grain refinement and strengthening effects, this sputtering target offers stable sputtering behavior, improved durability, and high-quality film formation. It is widely applied in semiconductors, displays, photovoltaic devices, and advanced R&D.

Detailed Description

Copper Zirconium sputtering targets are produced using advanced vacuum melting or powder metallurgy, followed by precision machining to achieve dense, uniform, and crack-free targets.

  • Composition: Typically Cu with 0.1–1.0 wt% Zr; custom compositions available.

  • Purity: ≥ 99.9% ensures low contamination and reliable thin film performance.

  • Microstructure: Fine-grained, homogeneous alloy minimizes arcing and enhances film adhesion.

  • Dimensions: Available in circular (25–300 mm), rectangular, or custom shapes; thickness 3–6 mm.

  • Bonding Options: Indium or elastomer bonding to copper or titanium backing plates for improved heat dissipation and mechanical stability.

Applications

Copper Zirconium sputtering targets are used in multiple industries and research fields:

  • Semiconductors – Conductive and barrier films in microelectronic devices.

  • Display Technology – Transparent and conductive films for TFT-LCD and OLEDs.

  • Photovoltaics – Back contact and functional coatings in solar cells.

  • Decorative Coatings – Corrosion-resistant, durable thin films for consumer goods.

  • R&D – Alloy thin films for materials science and next-generation electronics.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity≥ 99.9%Ensures stable electrical/optical film properties
Diameter25 – 300 mm (custom)Compatible with most sputtering systems
Thickness3 – 6 mmAffects sputtering efficiency and deposition rate
BondingCopper / Titanium backingImproves thermal transfer and stability
Composition (Cu:Zr)0.1–1.0 wt% Zr (customizable)Enhances strength & film adhesion

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Copper Zirconium Alloy TargetConductivity + strength, grain refinementSemiconductors, photovoltaics
Pure Copper TargetExcellent electrical conductivityInterconnects, wiring films
Pure Zirconium TargetHigh corrosion resistanceSpecialty coatings, R&D

FAQ

QuestionAnswer
Can the Zr content be adjusted?Yes, zirconium concentration can be customized to suit application needs.
What is the lead time?Typically 2–3 weeks depending on specifications and quantity.
Is backing plate bonding required?Recommended for large-diameter or high-power sputtering systems.
How are targets packaged?Vacuum-sealed with desiccants, cushioned with foam, and shipped in export-safe cartons or wooden crates.
Which industries use CuZr targets most?Electronics, display technologies, solar energy, and advanced materials research.

Packaging

Copper Zirconium sputtering targets are vacuum-sealed to prevent oxidation, labeled for traceability, and packed with protective foam in export-grade cartons or wooden crates to ensure safe transport and storage.

Conclusion

Copper Zirconium Sputtering Targets combine the conductivity of copper with the strengthening effect of zirconium, making them ideal for reliable thin film deposition in semiconductors, displays, and photovoltaic applications. With customizable purity, composition, and bonding options, they deliver high performance for both industrial and research applications.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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