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ST0011B Copper Zirconium Sputtering Target

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Copper Zirconium Sputtering Targets

Overview

Copper Zirconium Sputtering Targets are high-performance alloy targets composed of copper and zirconium, ideal for a range of applications in semiconductor, optics, and thin-film deposition technologies. With their superior purity and refined microstructure, these targets deliver excellent results in various processes, including CVD and PVD.

Specifications

  • Purity: 99.95%
  • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm
  • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Applications

  • Semiconductor Manufacturing
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)
  • Optical Applications

Key Features

  • Competitive Pricing: Affordable, high-quality sputtering targets.
  • High Purity: 99.95% purity ensures superior deposition quality.
  • Grain Refinement: Engineered microstructure for optimal film properties.
  • Semiconductor Grade: Meets strict standards for advanced manufacturing processes.

Manufacturing Process

  • Refining: Three-layer electrolytic process ensures top-tier quality.
  • Melting and Casting: Semi-continuous casting in an electrical resistance furnace.
  • Grain Refinement: Thermomechanical treatment to enhance material properties.
  • Cleaning and Packaging: Thoroughly cleaned for use in vacuum and protected during shipment from environmental contaminants.

Available Options

  • Purity: Minimum 99.95% purity.
  • Smaller Sizes: Available for R&D applications.
  • Sputtering Target Bonding: Custom bonding services for specific needs.

For more details or to inquire about Copper Zirconium Sputtering Targets, please contact us today.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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