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ST0929 Cryolite Sputtering Target, Na3??AlF6

Chemical FormulaNa3·AlF6
Catalog No.ST0929
CAS Number15096-52-3
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Cryolite sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cryolite Sputtering Target Description

The Cryolite Sputtering Target is a key component in the sputtering technique, which is used to apply thin films onto various substrates. Cryolite, a mineral composed of sodium (Na), aluminum (Al), and fluorine (F), serves as the target material in this process.

During sputtering, an intense ion beam is directed at the Cryolite Sputtering Target. This bombardment causes atoms or molecules from the target’s surface to be ejected. These ejected particles then migrate to the substrate, where they form a thin film that mirrors the properties of the original cryolite material. This method is essential for producing thin films with precise characteristics, which are crucial for applications in electronics, optics, and several other fields.

Related Product: Sodium Fluoride Sputtering Target

Cryolite Sputtering Target Specifications

Compound FormulaNa3·AlF6
Molecular Weight209.94
AppearanceGray target
Melting Point (℃)950-1012
Density (g/cm3)2.9-3.0
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Cryolite Sputtering Target Handling Notes

Indium bonding is indeed recommended for Cryolite Sputtering Targets due to their inherent challenges with sputtering. Cryolite’s properties, such as brittleness and low thermal conductivity, make it less suitable for direct sputtering without additional measures.

Reasons for Indium Bonding:

  1. Brittleness: Cryolite can be prone to cracking or breaking under the stress of the sputtering process. Indium bonding helps to mitigate this issue by providing a more flexible connection between the target and the sputtering system.
  2. Low Thermal Conductivity: Cryolite’s low thermal conductivity means that heat generated during sputtering is not efficiently dissipated. Indium bonding helps to distribute the heat more evenly, reducing the risk of thermal damage or deformation.
  3. Thermal Shock Susceptibility: Due to its susceptibility to thermal shock, Cryolite can experience significant temperature changes during sputtering. Indium bonding can cushion these temperature fluctuations and maintain the integrity of the target.

Using Indium bonding thus ensures that Cryolite Sputtering Targets perform reliably and maintain their quality throughout the sputtering process.

Cryolite Sputtering Target Application

  1. Optical Coatings:
    • Anti-Reflective Coatings: Cryolite thin films can be utilized to reduce reflections and enhance the transmission of light through optical surfaces.
    • Interference Filters: The unique optical properties of cryolite make it suitable for creating interference filters that selectively transmit or block certain wavelengths of light.
  2. Semiconductor Manufacturing:
    • Electronic Devices: Cryolite coatings may be applied in the fabrication of semiconductors, where their properties can contribute to the performance and reliability of electronic components.
    • Optoelectronic Devices: Cryolite thin films can also be used in optoelectronic applications, including sensors and light-emitting devices, where specific material characteristics are beneficial.
  3. Research and Development:
    • Specialized Applications: In R&D settings, cryolite thin films can be explored for novel applications or to study their behavior in various environments, taking advantage of their unique physical and chemical properties.

Cryolite sputtering targets are thus valuable for a range of high-tech applications, benefiting from their distinctive properties in both practical and research contexts.

Cryolite Sputtering Target Packaging

Our Cryolite Sputtering Target is widely used in various coating applications, leveraging its unique properties to enhance the performance and durability of different materials. Key applications include:

  • Improving Wear Resistance: Cryolite coatings contribute to the extended life and durability of tools by providing a protective layer that withstands wear and tear.
  • Enhancing Surface Durability: The application of cryolite thin films improves the overall resilience and longevity of surfaces exposed to harsh conditions.
  • Providing Specific Optical Properties: Cryolite coatings are used to achieve desired optical characteristics, such as anti-reflective properties and interference filters.
  • Delivering Electrical Properties: In some applications, cryolite coatings are utilized to impart specific electrical properties to devices and components.

Our Cryolite Sputtering Targets are carefully handled during storage and transportation to ensure they retain their high quality and performance in their original condition.

Get Contact

TFM offers Cryolite Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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