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VD0545 Dysprosium Evaporation Materials, Dy

Material Type: Dysprosium
Symbol: Dy
Color/Appearance: Silvery Metallic
CAS Number: 7429-91-6
Purity: 99.5% ~ 99.9%
Shape: Powder/ Granule/ Custom-made

TFM is a leading manufacturer and supplier of high-purity dysprosium evaporation materials, as well as a diverse range of other evaporation products. We provide our dysprosium materials in both powder and granule forms, with customizable options available to meet specific requirements.
MSDS File

Dysprosium Evaporation Materials Description

High-purity dysprosium evaporation materials are essential for producing high-quality films in deposition processes. Dysprosium, a rare earth element named from the Greek word ‘dysprositos,’ meaning ‘hard to get,’ is not found naturally in its pure form but occurs in minerals like xenotime.

TFM specializes in manufacturing dysprosium evaporation materials with purity levels up to 99.9%. Our rigorous quality assurance procedures ensure that these materials meet the highest standards of reliability and performance.

Dysprosium Evaporation Materials Specification

Material TypeDysprosium
SymbolDy
Color/AppearanceSilvery White, Metallic
Melting Point1,412 °C
Thermal Conductivity11 W/m.K
Density8.55 g/cc
SynonymsDy Pellets, Dy Pieces, Dy Evaporation Pellet, Dysprosium Pellets, Dysprosium Pieces, Dysprosium Evaporation Pellet

Dysprosium Evaporation Materials Applications

Dysprosium evaporation materials are used in various deposition processes, including semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). In optics, they are applied for wear protection, decorative coatings, and display technologies, benefiting from their high purity and performance characteristics.

Dysprosium Evaporation Materials Packing

We handle our dysprosium evaporation materials with the utmost care to prevent damage during storage and transportation. This meticulous approach ensures that the materials maintain their original quality and reliability.

Ordering Table

Material Size Quantity Purity Part Number
Dysprosium < 5mm 100 g 99.9% EVMDYX5MM-D

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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