Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
chromium-fluoride-crf3-sputtering-target-removebg-preview-1

ST0240 Dysprosium Fluoride Sputtering Target, DyF3

Chemical Formula: DyF3
Catalog Number: ST0240
CAS Number: 13569-80-7
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Dysprosium Fluoride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Dysprosium Fluoride Sputtering Target Description

Dysprosium fluoride sputtering target is a specialized ceramic sputtering material made up of dysprosium (Dy) and fluorine (F). It is used in various high-precision applications, including thin film deposition, semiconductor manufacturing, and coating technologies. This material is known for its unique properties, making it valuable in the production of high-performance optical and electronic devices.

DysprosiumDysprosium is a chemical element named after the Greek word ‘dysprositos,’ which means “hard to get.” It was first identified in 1886 by the French chemist P.E.L. de Boisbaudran. The element is represented by the symbol “Dy” and has an atomic number of 66 in the periodic table. Located in Period 6 and Group 3, it belongs to the f-block elements, commonly known as lanthanides. The relative atomic mass of dysprosium is approximately 162.500 Dalton, with the value in brackets indicating the measurement’s uncertainty.

Related Product: Dysprosium Sputtering Target

Fluorine

Fluorine, often referred to as “fluorin,” is a chemical element that derives its name from the Latin word ‘fluere,’ meaning “to flow.” It was first identified in 1810 by André-Marie Ampère and later isolated by Henri Moissan. The element has the chemical symbol “F” and is positioned in Period 2, Group 17 of the periodic table, which is part of the p-block. Fluorine has an atomic number of 9, and its relative atomic mass is approximately 18.9984032 Dalton, with the value in brackets indicating the uncertainty in the measurement.

Dysprosium Fluoride Sputtering Target Application

The dysprosium fluoride sputtering target is utilized in a variety of applications, including thin film deposition, decoration, and semiconductor technologies. It is also used in the production of displays, LED and photovoltaic devices, and for functional coatings. This material finds further applications in optical information storage, the glass coating industry, including car glass and architectural glass, and optical communication systems, offering versatility in enhancing the performance and durability of these products.

Dysprosium Fluoride Sputtering Target Packing

Our dysprosium fluoride sputter targets are meticulously tagged and labeled externally to ensure precise identification and quality control. We take great care in handling and packaging these targets to prevent any damage during storage or transportation, thereby preserving the integrity and quality of the products.

Get Contact

Dysprosium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Reviews

There are no reviews yet.

Be the first to review “ST0240 Dysprosium Fluoride Sputtering Target, DyF3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top