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ST0240 Dysprosium Fluoride Sputtering Target, DyF3

Chemical Formula: DyF3
Catalog Number: ST0240
CAS Number: 13569-80-7
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Dysprosium Fluoride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

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Dysprosium Fluoride Sputtering Target

Introduction

The Dysprosium Fluoride (DyF₃) Sputtering Target is a specialized material for thin film deposition, widely valued in optics, semiconductors, and energy technologies. With the strong magnetic properties of dysprosium and the optical transparency of fluorides, DyF₃ films exhibit unique optical and electronic behaviors, making them suitable for high-performance coatings in lasers, displays, and photonic devices.

Detailed Description

Dysprosium Fluoride sputtering targets are manufactured using high-purity DyF₃ powders (≥99.9%) through sintering or hot-pressing. The resulting dense, uniform targets ensure efficient sputtering and stable thin film growth. Key features include:

  • High Purity (≥99.9%): Critical for minimizing impurities in optical and electronic coatings.

  • Uniform Microstructure: Provides consistent sputtering rates and smooth films.

  • Stable Chemical Properties: Excellent resistance to moisture and high temperatures in vacuum deposition.

  • Custom Sizes: Available in standard and custom dimensions, from 25 mm up to 300 mm diameter.

  • Bonding Options: Indium, copper, or elastomer backing for enhanced thermal management.

The DyF₃ compound has a relatively wide bandgap and high refractive index, making it suitable for optical coatings and functional thin films.

Applications

Dysprosium Fluoride sputtering targets are applied in:

  • Optical coatings: Anti-reflective and laser mirror coatings.

  • Semiconductors: Thin films for electronic and optoelectronic devices.

  • Photonic devices: Used in display technologies and communication optics.

  • Energy applications: Coatings for specialized energy storage and conversion devices.

  • Research & Development: Advanced material studies in rare-earth fluoride thin films.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity≥99.9% (3N)Reduces film contamination
Diameter25 – 300 mm (custom)Fits various sputtering systems
Thickness3 – 6 mmInfluences sputtering rate and lifetime
Density~6.2 g/cm³Ensures stable sputtering
BondingIndium, Copper, ElastomerImproves target strength & heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Dysprosium FluorideHigh refractive index, stable filmsOptical coatings, lasers
Yttrium Fluoride (YF₃)Broad IR transparencyInfrared optics
Magnesium Fluoride (MgF₂)Low refractive index, durabilityAnti-reflective coatings

FAQ

QuestionAnswer
Can DyF₃ sputtering targets be customized?Yes, we offer custom diameters, thicknesses, and bonding solutions.
How is it packaged?Each target is vacuum-sealed, cushioned with protective foam, and packed in export-safe cartons or wooden crates.
Which industries use DyF₃ targets?Optics, semiconductors, photonics, and advanced R&D.
Do you provide bonded targets?Yes, indium, copper, and elastomer bonding options are available.

Packaging

Our Dysprosium Fluoride sputtering targets are carefully vacuum-sealed and securely cushioned to prevent oxidation or physical damage. Each piece is labeled for traceability and shipped in export-compliant packaging for worldwide delivery.

Conclusion

The Dysprosium Fluoride (DyF₃) Sputtering Target is a high-value material for advanced thin film deposition, offering stability, high purity, and versatility across optics, semiconductors, and energy applications. With customizable dimensions and bonding options, it is a reliable choice for both industrial use and cutting-edge research.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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