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VD0696 Fe3O4 Iron Oxide Evaporation Materials

Catalog No.VD0696
MaterialIron Oxide (Fe3O4)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands at the forefront of the manufacturing and supply of ultra-pure Fe3O4 iron oxide evaporation materials. We provide a diverse range of evaporation materials, available in both powder and granule forms. For those with specific needs, we also offer custom formulations upon request.

 

MSDS File

Fe3O4 Iron Oxide Evaporation Materials Overview

TFM offers premium Fe3O4 iron oxide evaporation materials, renowned for their high purity and effectiveness in deposition processes. Our Fe3O4 materials are crucial for achieving superior film quality in various deposition techniques. With a commitment to excellence, TFM ensures that our products reach a purity level of up to 99.9995%, supported by rigorous quality assurance procedures to guarantee reliability.

Related Products: Iron Evaporation Materials, Oxide Ceramic Evaporation Materials

Specifications

Material TypeIron(II,III) Oxide
SymbolFe3O4
Color/AppearanceBlack Solid
Melting Point1,597 °C
Theoretical Density 5 g/cm3
Purity99.5% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications

Our Fe3O4 iron oxide evaporation materials are ideal for:

  • Deposition processes such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics applications, including wear protection, decorative coatings, and display technologies.

Packaging

We ensure that our Fe3O4 iron oxide evaporation materials are securely packaged and clearly labeled to facilitate easy identification and quality control. Every effort is made to prevent damage during storage and transportation.

Contact Us

TFM is a top-tier manufacturer and supplier of high purity Fe3O4 iron oxide evaporation materials. We offer our products in various forms, including tablets, granules, rods, and wires, with custom options available upon request. Additionally, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing inquiries or to request materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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