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Gadolinium Oxide Sputtering Target

ST0148 Gadolinium Oxide Sputtering Target, Gd2O3

Chemical Formula: Gd2O3
Catalog Number: ST0148
CAS Number: 12064-62-9
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Gadolinium Oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Gadolinium Oxide Sputtering Target Description

GadoliniumThe Gadolinium Oxide Sputtering Target from TFM is an oxide sputtering material composed of gadolinium (Gd) and oxygen (O).

Gadolinium is a chemical element named after Johan Gadolin, a chemist, physicist, and mineralogist. It was first mentioned in 1880 and observed by J. C. G. de Marignac, with its isolation later accomplished and announced by F. L. de Boisbaudran. The chemical symbol for gadolinium is “Gd,” and its atomic number is 64. Gadolinium is located in Period 6, Group 3 of the periodic table, within the f-block. Its relative atomic mass is 157.25(3) Dalton, with the number in brackets indicating the measurement uncertainty. Gadolinium is known for its magnetic properties and is widely used in medical imaging, particularly in magnetic resonance imaging (MRI) contrast agents.

Related Product: Gadolinium Sputtering Target

OxygenOxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in parentheses indicating the measurement uncertainty. Oxygen is essential for life, playing a critical role in respiration, combustion, and various chemical reactions.

Gadolinium Oxide Sputtering Target Specification

Material Type   Gadolinium Oxide
Compound Formula Gd2O3
Molecular Weight 362.5
Appearance White
Melting Point 2,420° C (4,388° F)
Density 7.407 g/cm3
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Gadolinium Oxide Sputtering Target Bonding Service

Specialized bonding services for Gadolinium Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Gadolinium Oxide Sputtering Target Application

The Gadolinium Oxide (Gd2O3) Sputtering Target is used in a variety of applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also important for functional coatings, the optical information storage industry, glass coatings for automotive and architectural glass, and optical communication systems, among other fields.

Gadolinium Oxide Sputtering Target Packaging

Our Gadolinium Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. We take great care to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

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TFM offers Gadolinium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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