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VD0846BGallium Sulfide Pellet Evaporation Material (GaS)

MSDS File
Material TypeGallium Sulfide
SymbolGaS
Color/AppearanceYellow crystals
Melting Point (°C)965
Theoretical Density (g/cc)3.86
Z Ratio–
E-Beam–
Thermal Evaporation TechniquesBoat:  –
Crucible:  –
E-Beam Crucible Liner Material–
Temp. (°C) for Given Vap. Press. (Torr)–
Comments–

Gallium Sulfide Pellet Evaporation Material

TFM provides high-purity Gallium Sulfide Pellet Evaporation Material, an essential compound for thin-film deposition in semiconductor, optoelectronic, and photonic applications. Composed of gallium (Ga) and sulfur (S), gallium sulfide (Ga2S3) exhibits excellent optical transparency, wide bandgap semiconductor properties, and high thermal stability, making it ideal for photodetectors, solar cells, and infrared optical coatings.

Engineered for thermal evaporation and electron beam (E-beam) deposition, this material ensures uniform film thickness, high purity, and strong adhesion to substrates, meeting the demands of advanced research and industrial applications.

Key Features and Advantages

  • Wide Bandgap Semiconductor: Gallium sulfide offers a large bandgap, making it suitable for high-performance photodetectors, optoelectronic devices, and energy-efficient semiconductors.
  • Superior Optical Transparency: Exhibits high transmission in the infrared and visible spectrum, enhancing its use in optical coatings and photonic systems.
  • Excellent Stability & Durability: Provides high thermal and chemical stability, ensuring long-lasting performance in extreme environments.
  • High Purity & Precise Deposition: Enables uniform thin-film coatings with minimal defects, improving device efficiency and reliability.
  • Customizable Composition: TFM offers tailored material specifications to meet specialized research and industrial needs.

Applications

  • Photodetectors & Imaging Sensors: Used in high-sensitivity photodetectors, night vision devices, and infrared cameras for security, defense, and scientific applications.
  • Optoelectronics & Semiconductor Devices: Plays a crucial role in light-emitting diodes (LEDs), transistors, and next-generation semiconductor technologies.
  • Solar Cells & Photovoltaics: Enhances solar energy conversion efficiency, supporting thin-film solar panels and energy harvesting systems.
  • Infrared Optical Coatings: Applied in high-performance optical coatings for infrared optics, lasers, and sensor protection.
  • Thin-Film Deposition: Ideal for vacuum coating applications, ensuring high-quality semiconductor films for advanced electronics.

Industry Impact and Customization

TFM’s Gallium Sulfide Pellet Evaporation Material is a critical component in infrared optics, semiconductor research, and energy-efficient optoelectronic applications. By providing high-purity materials, precise deposition control, and customizable formulations, TFM ensures that its solutions meet the demands of cutting-edge research and industrial production.

With its wide bandgap properties, superior optical performance, and thermal stability, Gallium Sulfide Pellet Evaporation Material from TFM plays a key role in developing next-generation photodetectors, advanced optoelectronics, and high-efficiency solar technologies.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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