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Gallium(II) Telluride Evaporation Materials

VD0860 Gallium(II) Telluride Evaporation Materials, Ga2Te3

Catalog No.VD0860 Ga2Te3-VD
MaterialGallium Telluride (Ga2Te3)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity gallium(II) telluride evaporation materials, as well as a diverse range of other evaporation materials. We provide our products in both powder and granule forms, with customized options available to meet specific requirements. Our commitment to quality ensures that our materials meet the highest standards for performance and reliability.

MSDS File

Gallium(II) Telluride Evaporation Materials Overview

Gallium(II) telluride, denoted as Ga2Te3, is a critical material in evaporation processes, especially for high-quality film deposition. Our high-purity Ga2Te3, produced by TFM, ensures top-notch performance in deposition applications. We take pride in delivering materials with purity levels reaching up to 99.9995%, supported by rigorous quality assurance practices that guarantee the reliability and consistency of our products.

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Product Specifications

Material TypeGallium(II) Telluride
SymbolGa2Te3
Appearance/ColorBlack solid
Melting Point1,041 °C (1,906 °F; 1,314 K)
Density5.85 g·cm−3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Gallium(II) telluride is extensively used in various deposition techniques such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). It is also integral to optical applications, including wear-resistant coatings, decorative finishes, and display technologies.

Packaging

Our gallium(II) telluride evaporation materials are meticulously packaged in plastic vacuum bags to maintain their quality and protect them during storage and transport. Each package includes a Certificate of Analysis (COA) to ensure transparency and traceability of the product’s quality.

Contact Us

TFM is dedicated to producing high-purity gallium(II) telluride evaporation materials that excel in semiconductor, CVD, PVD, and optical applications. Our combined expertise in engineering, manufacturing, and analytical services sets us apart in the industry. For inquiries or further information, please reach out to us today.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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