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Germanium Selenide Evaporation Materials

VD0847 Germanium Selenide Evaporation Materials, GeSe2

Catalog No.VD0847
MaterialGermanium Selenide (GeSe2)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier provider of high-purity germanium selenide and a broad range of evaporation materials. Our offerings include both powder and granule forms to suit various applications. We also accommodate special requests for customized forms to meet specific requirements.

MSDS File

Germanium Selenide Evaporation Materials Overview

Germanium selenide, represented by the chemical formula GeSe₂, is a high-purity selenide ceramic used in evaporation processes. This material is essential for producing high-quality thin films in various deposition methods. TFM specializes in manufacturing germanium selenide with purity levels reaching up to 99.9995%, ensuring exceptional product reliability.

Specifications of Germanium Selenide Evaporation Materials

Material TypeGermanium selenide
SymbolGeSe2
Appearance/ColorBlack
Melting Point667 °C (1,233 °F; 940 K) (decomposes)
Density5.56 g/cm3
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications

Germanium selenide is used in several deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). It is particularly useful in optics for applications such as wear protection, decorative coatings, and display technologies.

Packaging and Handling

To ensure the quality and integrity of germanium selenide, materials are carefully tagged and labeled. We take great care to prevent damage during storage and transportation.

Contact Us

TFM is a leading manufacturer and supplier of high-purity germanium selenide evaporation materials. We offer various forms, including tablets, granules, rods, and wires, with customization options available upon request. We also provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about materials not listed, please get in touch with us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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