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VD0861 Germanium Telluride Evaporation Materials, GeTe

Catalog No.VD0861
MaterialGermanium Telluride (GeTe)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top manufacturer and supplier specializing in high-purity germanium telluride and a diverse range of evaporation materials. Our products are available in both powder and granule forms, with the option for custom formulations to meet specific requirements.

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Germanium Telluride Evaporation Materials Overview

Germanium telluride (GeTe) is a high-purity ceramic material utilized in evaporation processes, critical for producing superior-quality deposited films. At TFM, we specialize in delivering germanium telluride evaporation materials with exceptional purity levels of up to 99.9995%. Our rigorous quality assurance measures ensure the reliability and consistency of our products.

Related Products: Germanium Evaporation Materials, Telluride Ceramic Evaporation Materials

Specifications of Germanium Telluride Evaporation Materials

Material TypeGermanium Telluride
SymbolGeTe
Appearance/ColorSolid
Melting Point725 °C (1,337 °F; 998 K)
Density6.14 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications of Germanium Telluride Evaporation Materials

Germanium telluride evaporation materials are employed in various deposition techniques including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

They are primarily used for optical applications such as wear-resistant coatings, decorative finishes, and display technologies.

Packaging of Germanium Telluride Evaporation Materials

To maintain the integrity and quality of our germanium telluride evaporation pellets, we package them in plastic vacuum bags. This packaging safeguards against damage during storage and transport. Each package also includes a Certificate of Analysis (COA) for the raw material.

Contact Us

TFM is committed to providing high-purity germanium telluride evaporation materials tailored for semiconductor, CVD, PVD, and optical applications. Our integrated engineering, manufacturing, and analytical capabilities set us apart in the industry. Reach out to us today for inquiries and further information.

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GeTe Target 3N ø50.8mm / 2” * 6.35mm / 1/4”, GeTe Target 3N ø50.8mm / 2” * 3.175mm / 1/8”

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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