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ST0322 Germanium Telluride Sputtering Target, GeTe

Chemical Formula: GeTe
Catalog Number: ST0322
CAS Number: 12025-39-7
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Germanium Telluride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Germanium Telluride Sputtering Target (GeTe)

Introduction

The Germanium Telluride (GeTe) Sputtering Target is a high-performance semiconductor material widely used in thin film deposition, particularly for phase-change memory (PCM) devices and thermoelectric applications. As a compound of germanium (Ge) and tellurium (Te), GeTe exhibits unique electrical and optical properties that make it ideal for data storage, infrared optics, and advanced material research.

Detailed Description

Germanium telluride is a narrow-bandgap semiconductor and a key member of the chalcogenide family. It undergoes rapid and reversible transitions between amorphous and crystalline states, enabling its use in non-volatile memory and optical switching devices.

The GeTe sputtering target is typically fabricated by hot pressing or vacuum sintering to ensure high density and homogeneity. These characteristics provide smooth deposition behavior, stable sputtering rates, and uniform film thickness with minimal particle generation.

Key Features:

  • Phase-change capability – fast and stable transition between amorphous and crystalline states.

  • High purity and density – ensures defect-free thin films and consistent resistivity.

  • Good thermal and electrical conductivity.

  • Customizable compositions (e.g., doped GeTe) for enhanced film properties.

Applications

Germanium Telluride sputtering targets are widely used in:

  • Phase-change memory (PCM) – rewritable non-volatile data storage.

  • Optical recording media – Blu-ray and DVD re-writable discs.

  • Thermoelectric devices – thin films for energy harvesting and cooling.

  • Infrared optical coatings – due to high refractive index and IR transparency.

  • Research and development – chalcogenide materials and novel phase-change technologies.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaGeTeDefines compound stoichiometry
Purity99.9% – 99.999%Higher purity improves film reliability
Density≥ 6.1 g/cm³Ensures high sputtering efficiency
Diameter25 – 300 mm (custom)Compatible with different sputtering systems
Thickness3 – 10 mmBalances film uniformity and target lifespan
Backing PlateCopper / MolybdenumEnhances heat dissipation and bonding strength

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Germanium Telluride (GeTe)Phase-change and thermoelectric usePCM & IR coatings
Ge₂Sb₂Te₅ (GST)Multi-level phase-change materialData storage devices
Antimony Telluride (Sb₂Te₃)High thermoelectric efficiencyEnergy conversion films
Bismuth Telluride (Bi₂Te₃)Excellent n-type thermoelectric materialCooling devices

FAQ

QuestionAnswer
Can GeTe targets be customized?Yes, composition, size, and purity can be tailored.
Is it suitable for RF or DC sputtering?It can be used for both RF and DC magnetron sputtering.
What is the typical film color?Films range from metallic gray to dark depending on thickness and structure.
How is it packaged?Vacuum-sealed, foam-protected, and shipped in export-safe cartons.
Which industries use it most?Semiconductor, optical storage, and thermoelectric energy industries.

Packaging

Each Germanium Telluride Sputtering Target is vacuum-sealed in moisture-proof packaging with desiccants and cushioned with protective foam. Export-grade cartons or wooden crates ensure safe delivery worldwide.

Conclusion

Germanium Telluride sputtering targets offer an exceptional balance of electrical conductivity, phase-change capability, and optical performance. These properties make GeTe an essential material for next-generation memory, infrared optics, and thermoelectric devices.

For detailed specifications and quotations, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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