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ST0488 Gold Zinc Sputtering Target, Au/Zn

Chemical Formula: Au/Zn
Catalog Number: ST0488
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Gold Zinc sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Gold Zinc Sputtering Target Description

GoldGold is a chemical element named after the Anglo-Saxon word *gold* (from the Latin *aurum*, meaning “glow of sunrise”). It was used as early as 6000 BC and discovered by ancient peoples in the Middle East. The chemical symbol for gold is “Au,” and it is located in Period 6, Group 11 of the periodic table, within the d-block. Its atomic number is 79, and its relative atomic mass is 196.966569, with the number in brackets indicating the uncertainty.

ZincZinc is a chemical element named after the German word *zinc*, which may be derived from the Persian word *sing*, meaning “stone.” It was used as early as 1000 BC and discovered by Indian metallurgists. The chemical symbol for zinc is “Zn,” and it is located in Period 4, Group 12 of the periodic table, within the d-block. Its atomic number is 30, and its relative atomic mass is 65.409, with the number in brackets indicating the uncertainty.

Related Products: Gold sputtering target, Zinc sputtering target.

Gold Zinc Sputtering Target Specifications

Material TypeGold Zinc
SymbolAu/Zn
Melting Point1063 °C
DensityDensity
Color/AppearanceGold-colored solid
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Packing

Our Gold Zinc Sputtering Targets are clearly tagged and labeled for efficient identification and quality control. We take great care to prevent any damage during storage and transportation, ensuring the targets remain in excellent condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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