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Hafnium Carbonitride Sputtering Target

Hafnium Carbonitride Sputtering Target, HfCN

Hafnium Carbonitride Sputtering Target

Introduction

The Hafnium Carbonitride (HfCN) Sputtering Target is a high-performance ceramic material widely used in thin film deposition. With a unique combination of hafnium, carbon, and nitrogen, it delivers excellent hardness, thermal stability, and chemical resistance. This makes it valuable in industries where protective, wear-resistant, or functional coatings are essential, including semiconductors, optics, and advanced energy systems.

Detailed Description

Hafnium carbonitride is known for its ultra-high melting point and remarkable resistance to oxidation when processed under controlled conditions. As a sputtering target, it is typically manufactured through hot pressing or sintering to achieve high density and uniform microstructure. The dense structure ensures stable sputtering rates, reduced particle generation, and reliable adhesion of deposited films.

Key properties include:

  • High hardness and mechanical strength – beneficial for wear-resistant coatings.

  • Excellent thermal stability – supports deposition in high-temperature environments.

  • Chemical inertness – provides corrosion and oxidation resistance.

  • Customizable composition – Hf:C:N ratios can be tailored for specific performance.

These characteristics make HfCN an advanced material choice for both research and industrial-scale applications.

Applications

Hafnium Carbonitride Sputtering Target is employed in:

  • Semiconductor devices – barrier layers, diffusion coatings, and advanced transistor structures.

  • Optical coatings – hard protective films with stable refractive properties.

  • Wear- and corrosion-resistant coatings – for cutting tools, aerospace parts, and turbine components.

  • Energy systems – protective layers in high-temperature fuel cells and plasma-facing materials.

  • R&D – advanced material studies in superhard coatings and next-generation electronics.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.5% – 99.9%Ensures minimal contamination in thin films
Density≥ 95% theoreticalHigher density reduces porosity and improves coating quality
Diameter25 – 300 mm (custom)Fits a variety of sputtering systems
Thickness3 – 10 mmAffects deposition stability and target life
Backing PlateCopper / MolybdenumEnhances thermal conductivity and mechanical support

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Hafnium Carbonitride (HfCN)Ultra-high hardness & thermal stabilityProtective & functional coatings
Hafnium Carbide (HfC)Extreme melting pointAerospace & high-temp coatings
Titanium Nitride (TiN)Cost-effective, good wear resistanceDecorative & industrial coatings
Zirconium Carbide (ZrC)High toughness & thermal conductivityCutting tools & electronics

FAQ

QuestionAnswer
Can HfCN targets be customized?Yes, purity, size, and bonding options can be tailored.
What bonding options are available?Standard bonding to copper or molybdenum backplates.
How are the targets packaged?Vacuum-sealed, foam protected, shipped in export-safe cartons or wooden crates.
What industries use it most?Semiconductor, aerospace, energy, optics, and advanced R&D.
Is it suitable for high-temperature applications?Yes, its ultra-high melting point makes it ideal for such conditions.

Packaging

Each Hafnium Carbonitride Sputtering Target is carefully vacuum-sealed, externally labeled, and cushioned with protective foam. Packaging ensures safe transport, preventing contamination or damage during storage and shipping.

Conclusion

Hafnium Carbonitride Sputtering Targets combine hardness, thermal resilience, and chemical stability, making them indispensable in demanding thin film applications. Their adaptability for custom specifications allows researchers and engineers to achieve precise deposition results.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

Order Now

HfCN target 99.9% at% ø30×3 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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