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ST0243 Hafnium Fluoride Sputtering Target, HfF4

Chemical Formula: HfF4
Catalog Number: ST0243
CAS Number: 13709-52-9
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Hafnium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Hafnium Fluoride Sputtering Target Description

Hafnium fluoride sputtering target is a ceramic material composed of hafnium and fluorine, typically represented by the chemical formula HfF₄. This material is used in various applications, including thin film deposition, where it serves as a source for creating coatings and layers in semiconductor, display, LED, and photovoltaic devices, as well as in other specialized optical and electronic applications.

HafniumHafnium is a chemical element named after Copenhagen, Denmark (Latin: Hania). It was first identified in 1911 by G. Urbain and V. Vernadsky. The element was later isolated and officially documented by D. Coster and G. von Hevesy. Hafnium is represented by the symbol “Hf” in the periodic table and has an atomic number of 72. It is located in Period 6, Group 4, within the d-block, and has a relative atomic mass of 178.49(2) Dalton, with the value in brackets indicating the measurement uncertainty.

Related Product: Hafnium Sputtering Target

Fluorine

Fluorine, also known as fluorin, is a chemical element with the symbol “F” and atomic number 9. The name fluorine is derived from the Latin word ‘fluere,’ which means “to flow.” It was first mentioned in 1810 by A.-M. Ampère, with its isolation later achieved and announced by H. Moissan. Fluorine is located in Period 2 and Group 17 of the periodic table, belonging to the p-block. Its relative atomic mass is 18.9984032(5) Dalton, with the number in brackets indicating the uncertainty in the measurement.

Hafnium Fluoride Sputtering Target Application

The hafnium fluoride sputtering target is widely used in various high-tech applications, including thin film deposition for decoration, semiconductor manufacturing, displays, LEDs, and photovoltaic devices. It is also employed in functional coatings, optical information storage, glass coatings for automotive and architectural glass, and optical communication systems. This material’s unique properties make it suitable for enhancing the performance and durability of these products.

Hafnium Fluoride Sputtering Target Packing

Our hafnium fluoride sputter targets are meticulously tagged and labeled externally to guarantee accurate identification and quality control. We take exceptional care in packaging and handling to prevent any damage during storage and transportation, ensuring that our products reach you in optimal condition.

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TFM offers Hafnium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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