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VD0553 Holmium Evaporation Materials, Ho

Catalog No.VD0553
MaterialHolmium (Ho)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM is a prominent producer and provider of high-purity holmium evaporation materials, alongside an extensive range of other evaporation materials. We supply these materials in both powder and granule forms, and can also accommodate customized requests to meet specific needs.

MSDS File

Holmium Evaporation Materials Description

Holmium metal, a soft and malleable rare earth element, is known for its corrosion resistance and stability in dry air at standard temperature and pressure. However, it readily oxidizes in moist air. Holmium has the highest magnetic moment of all naturally occurring elements and forms highly magnetic compounds when alloyed with yttrium. Under ambient conditions, holmium exhibits paramagnetic properties.

High-purity holmium evaporation materials are vital for achieving superior results in deposition processes, ensuring the production of high-quality deposited films. TFM specializes in manufacturing holmium evaporation materials with purity levels up to 99.95%, supported by stringent quality assurance processes to ensure product reliability.

holmium evaporation materials

Holmium Evaporation Materials Specification

Material TypeHolmium
SymbolHo
Color/AppearanceSilvery White, Metallic
Melting Point1,474°C
Density8.8 g/cc
Thermal Conductivity16 W/m.K
Coefficient of Thermal Expansion11.2 x 10-6/K
SynonymsHo Pellets, Ho Pieces, Ho Evaporation Pellet, Holmium Pellets, Holmium Pieces, Holmium Evaporation Pellet

Holmium Evaporation Materials Application

Holmium evaporation materials are integral in various deposition methods, including those used for semiconductors, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). These processes are critical for forming uniform layers in advanced electronics. Additionally, holmium is valuable in the field of optics, where it’s applied for enhancing surface protection, creating decorative coatings, and improving display technology performance.

Holmium Evaporation Materials Packaging

We take great care in handling our holmium evaporation materials, prioritizing proper storage and secure transportation to maintain their pristine quality and prevent any potential damage.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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