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ST0151 Indium Gallium Zinc Oxide IGZO Sputtering Target

Chemical Formula: InGaZnOx
Catalog Number: ST0151
CAS Number: 151248-91-8
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Indium Gallium Zinc Oxide (IGZO) Sputtering Targets  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

IGZO Sputtering Target Description

The IGZO sputtering target, also known as the Indium Gallium Zinc Oxide target, comprises four elements: indium (In), gallium (Ga), zinc (Zn), and oxygen (O). IGZO is a semiconductor material known for its higher electron mobility compared to amorphous silicon (α-Si). This property makes IGZO an ideal channel material in the new generation of high-performance thin-film transistors (TFTs), enhancing display panel resolution and enabling the development of large-screen OLED TVs.

IGZO Sputtering Target Specification

Material TypeIndium Gallium Zinc Oxide
SymbolIGZO
Color/AppearanceWhite, Crystalline Solid
Melting Point850 °C
Theoretical Density 6.5 g/cm3
Type of BondIndium
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

IGZO Sputtering Target Application

IGZO sputter targets are widely used for thin film deposition in various applications, including fuel cells, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. Additionally, IGZO thin films are applied in transparent conductive oxide films, LED displays, MEMS devices, and other advanced technological applications. This versatile material is particularly valued for its ability to enhance the performance and efficiency of electronic and optoelectronic devices.

IGZO Sputtering Target Bonding Services

Specialized bonding services for indium gallium zinc oxide IGZO Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Our Indium Gallium Zinc Oxide (IGZO) Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

Get Contact

TFM offers Indium Gallium Zinc Oxide (IGZO) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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