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Indium Tin Oxide Rotary Sputtering Target

Indium Tin Oxide (ITO) Rotary Sputtering Target

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TFM offers high-quality Indium Tin Oxide  rotary sputtering targets (ITO), widely used for the deposition of transparent conductive films in a variety of electronics, optoelectronics, and energy-related applications. ITO films are known for their excellent electrical conductivity, high optical transparency, and superior chemical stability, making them essential in touchscreens, flat-panel displays, solar cells, and smart windows.

The rotary sputtering target design ensures uniform and efficient deposition, promoting high-quality, consistent ITO films on large-area substrates. ITO’s high conductivity and transparency make it a critical material in applications requiring a combination of electrical performance and optical clarity, such as electrostatic dissipative coatings, conductive layers in photovoltaic devices, and optical filters.

TFM provides customized ITO rotary sputtering targets, offering precise control over material composition and purity to meet specific deposition requirements. These targets are engineered to deliver optimal results in thin-film deposition for industries such as displays, energy, and electronics, ensuring high-performance and reliable films for advanced applications.

Indium Tin Oxide  rotary sputtering targets (ITO) Specifications

MaterialsIndium Tin Oxide Rotary Sputtering Target
SymbolIn₂O₃/SnO₂, ITO
CompositionIn₂O₃/SnO₂ 90/10 wt%, In₂O₃/SnO₂ 97/3 wt% or other ratios
Purity≥99.99%
Theoretical Density (g/cc)7.14
Melting Point (°C)1,800
Production MethodBonded Type (Cold isostatic pressing + high-temperature sintering)
Backing TubeTitanium, Stainless Steel
Bonding MaterialIndium or Elastomer
SizeAs per customer’s drawings
Relative Density≥99%
Annual Capacity1,000 tons

Applications

  • Thin Film Photovoltaic Solar Industry
  • Touch Screens
  • Semiconductor Electronics Industry
  • Flat Panel Display Industry
  • Construction Glass Industry

TFM also offers recycling services for used ITO sputtering targets. The pricing for recycling is determined based on the remaining weight and the current market price of indium. This service supports sustainable practices and helps recover valuable materials.

For more information on ITO sputtering targets and recycling services, please contact TFM directly.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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