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ST0911 Iron Hafnium Sputtering Targets, Fe/Hf

Chemical FormulaFe/Hf
Catalog No.ST0911
CAS NumberN/A
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Iron Hafnium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Iron Hafnium Sputtering Targets Description

The Iron Hafnium Sputtering Target is a specialized material used in sputter deposition, a technique for depositing thin films onto substrates with high precision. This method is commonly applied in the manufacturing of electronic devices, semiconductors, and various thin-film technologies.

By combining iron and hafnium in the sputtering target, the resulting thin film will possess unique properties derived from both elements. The specific attributes and applications of the thin film will be determined by the intended use and desired characteristics of the final product.

Related Products: Iron Gallium Sputtering Target, Iron Chromium Sputtering Target, Iron Manganese Sputtering Target

Iron Hafnium Sputtering Targets Specifications

Compound FormulaFe/Hf
Molecular WeightN/A
AppearanceMetallic solid
Melting Point (℃)N/A
Boiling Point (℃)N/A
Density (g/cm3)N/A
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Iron Hafnium Sputtering Targets Application

The Iron Hafnium Sputtering Target is commonly used in the production of electronic devices, semiconductors, and various thin-film applications.

Iron Hafnium Sputtering Targets Packaging

Our Iron Hafnium Sputtering Targets are meticulously handled during storage and transportation to ensure they remain in pristine condition.

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TFM offers Iron Hafnium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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