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Iron Hafnium Sputtering Targets

ST0911 Iron Hafnium Sputtering Targets, Fe/Hf

Chemical FormulaFe/Hf
Catalog No.ST0911
CAS NumberN/A
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Iron Hafnium sputtering targetĀ  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Iron Hafnium (Feā€“Hf) Sputtering Targets are alloy deposition materials engineered for advanced thin film applications that require enhanced thermal stability, oxidation resistance, and controlled magnetic or mechanical properties. By alloying iron with hafnium, Feā€“Hf targets enable the formation of robust films suitable for semiconductor processing, functional coatings, and materials research.

Detailed Description

Iron Hafnium sputtering targets are manufactured from high-purity iron and hafnium through carefully controlled alloying and densification processes. Uniform elemental distribution is essential to ensure stable sputtering behavior, consistent erosion profiles, and reliable thin film composition across the targetā€™s lifetime.

Hafnium additions to iron can improve high-temperature strength, oxidation resistance, and microstructural stability of deposited films. These characteristics make Feā€“Hf targets attractive for applications involving elevated temperatures, diffusion control, or demanding operating environments.

Targets are available unbonded for smaller formats or lower power densities, and bonded to copper backing plates to enhance heat dissipation and mechanical stability during high-power magnetron sputtering. Composition, size, thickness, and bonding options can be customized to match specific process requirements.

Applications

  • Semiconductor and microelectronic thin films

  • Diffusion-resistant and high-temperature coatings

  • Magnetic and functional alloy film research

  • Protective and structural thin film layers

  • Academic and industrial PVD research

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialIron Hafnium (Feā€“Hf)Functional refractory alloy
CompositionCustom Fe/Hf ratio (wt.% or at.%)Tunes thermal & magnetic properties
Purity99.9% ā€“ 99.99% (total)Affects film reliability
FormDisc / Plate (bonded or unbonded)Sputtering system compatibility
Diameter25 ā€“ 300 mm (custom)Fits standard magnetron cathodes
Thickness3 ā€“ 6 mm (typical)Influences target lifetime
Backing PlateCopper (optional)Improves heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Iron Hafnium (Feā€“Hf)High-temperature & diffusion resistanceAdvanced functional films
Pure Iron (Fe)High magnetic permeabilityMagnetic coatings
Iron Chromium (Feā€“Cr)Corrosion resistanceProtective coatings

FAQ

QuestionAnswer
Can the Fe/Hf ratio be customized?Yes, alloy composition can be tailored to specific requirements.
Are bonded targets available?Yes, copper-backed targets are recommended for higher power sputtering.
Is DC sputtering suitable for Feā€“Hf targets?Yes, Feā€“Hf targets are typically used with DC magnetron sputtering.
Can large-diameter targets be supplied?Yes, targets up to 300 mm or larger can be produced on request.
Is a Certificate of Analysis provided?Yes, CoA is available upon request.

Packaging

Our Iron Hafnium Sputtering Targets are cleaned for vacuum service, individually labeled, and vacuum-sealed to prevent oxidation and contamination. Shock-absorbing materials and export-grade cartons or wooden crates are used to ensure safe transportation and storage.

Conclusion

Iron Hafnium Sputtering Targets deliver stable alloy composition, reliable sputtering performance, and flexible customization for demanding thin film deposition processes. With rigorous quality control and multiple configuration options, they are well suited for semiconductor, functional coating, and advanced materials research applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

Itā€™s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Alā‚‚Oā‚ƒ, SiOā‚‚, TiOā‚‚), alloys, or compositesā€”chosen based on the filmā€™s desired properties.

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They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

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In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

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Key factors include the targetā€™s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

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Operators monitor target erosion (often by measuring the depth of the eroded ā€œrace trackā€) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

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Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

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DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the targetā€™s surface.

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In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also ā€œpoisonā€ the target surface if not carefully controlled.

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Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

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Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

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