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Iron Manganese Sputtering Target

ST0093 Iron Manganese Sputtering Target, Fe/Mn

Chemical Formula: Fe/Mn
Catalog Number: ST0093
CAS Number: 7439-89-6 | 7439
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iron Manganese sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Iron Manganese Sputtering Target (Fe/Mn) is an alloy target widely used for depositing magnetic, antiferromagnetic, and functional alloy thin films. By combining iron’s magnetic characteristics with manganese’s ability to tailor magnetic ordering and electrical behavior, Fe/Mn targets support advanced thin-film research and device development in spintronics, magnetic sensors, and electronic materials. Their controllable composition and stable sputtering behavior make them a reliable choice for both R&D and pilot-scale production.

Detailed Description

Iron Manganese sputtering targets are manufactured from high-purity iron and manganese raw materials through controlled melting, alloying, and precision machining. Strict compositional control ensures homogeneous element distribution across the target, which is critical for maintaining film stoichiometry and reproducibility during sputtering.

Fe/Mn alloy targets exhibit stable erosion characteristics and predictable sputtering rates under magnetron sputtering conditions. By adjusting the Fe/Mn atomic or weight ratio, users can fine-tune thin-film properties such as magnetic ordering (including antiferromagnetic behavior), resistivity, and microstructure. Targets can be supplied as monolithic alloy discs or bonded to copper or titanium backing plates to improve heat dissipation and mechanical stability at higher power densities.

Applications

Iron Manganese sputtering targets are commonly used in:

  • Spintronic and magnetic thin-film research

  • Antiferromagnetic layers for exchange bias structures

  • Magnetic sensors and memory device development

  • Functional alloy thin films

  • Semiconductor and electronic materials research

  • Academic and industrial thin-film R&D

Technical Parameters

ParameterTypical Value / RangeImportance
Alloy CompositionFe/Mn (custom ratios available)Controls magnetic behavior
Purity99.9% – 99.99%Improves film consistency
Target Diameter25 – 300 mm (custom)Fits standard sputtering guns
Thickness3 – 6 mm (custom available)Influences sputtering stability
Density≥ 99% of theoreticalEnsures uniform erosion
Backing PlateOptional (Cu / Ti)Enhances thermal management
Deposition MethodDC / RF Magnetron SputteringProcess flexibility

Comparison with Related Magnetic Alloy Targets

MaterialKey AdvantageTypical Application
Iron Manganese (Fe/Mn)Tunable antiferromagnetic propertiesSpintronics & sensors
Iron Cobalt (FeCo)High magnetic saturationMagnetic cores
Nickel Iron (NiFe)Soft magnetic behaviorMagnetic shielding
Cobalt Manganese (CoMn)Exchange bias controlMagnetic multilayers

FAQ

QuestionAnswer
Can the Fe/Mn ratio be customized?Yes, alloy composition can be tailored to application requirements.
Is DC sputtering suitable?Yes, DC sputtering is commonly used for Fe/Mn alloy targets.
Is bonding recommended?Bonded targets are recommended for larger sizes or higher power use.
Are small research targets available?Yes, laboratory-scale diameters and thicknesses are supported.
How is the target packaged?Vacuum-sealed with protective cushioning to prevent oxidation.

Packaging

Our Iron Manganese Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each target is vacuum-sealed and protected with shock-absorbing, moisture-resistant materials to prevent damage or contamination during storage and transportation.

Conclusion

The Iron Manganese Sputtering Target (Fe/Mn) offers a versatile material platform for depositing magnetic and antiferromagnetic alloy thin films with controlled composition and reliable performance. With customizable alloy ratios, stable sputtering behavior, and consistent quality, Fe/Mn targets are well suited for advanced magnetic research and next-generation electronic applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

FeMn Target 50–50 at% 3N Ø50.8 mm × 5 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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