Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
iron-sputtering-target

ST0023 Iron Sputtering Target, Fe

Chemical Formula: Fe
Catalog Number: ST0023
CAS Number: 7439-89-6
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iron sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Availability: 1 in stock

Iron Sputtering Target Description

iron

The iron sputtering target is a metallic solid target made from high-purity iron. Iron, also known as ferrum, derives its name from the Anglo-Saxon word “iren” and the Latin word “ferrum.” Used since before 5000 BC, iron has the chemical symbol “Fe.” It has an atomic number of 26, located in Period 4, Group 8 of the periodic table, within the d-block. The relative atomic mass of iron is 55.845(2) Dalton, with the number in brackets indicating uncertainty.

Iron is biologically important for carrying oxygen in the blood. It is evaporated under vacuum to form layers in the production of semiconductors, magnetic storage media, and fuel cells, among other applications.

Iron Sputtering Target Specification

Material Type Iron
Symbol Fe
Color/Appearance Solid
Melting Point 1,535 °C
Sputter DC
Density 7.86 g/cc
Thermal Conductivity 80 W/m.K
Coefficient of Thermal Expansion 11.8 x 10-6/K
Comments Attacks W. Films hard, smooth. Preheat gently to outgas.
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Iron Sputtering Target Application

The iron sputtering target is used for thin film deposition in applications such as decoration, semiconductors, displays, LEDs, photovoltaic devices, functional coatings, optical information storage, glass coatings (including car and architectural glass), and optical communication.

Packaging

Our Iron Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Iron Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0023 Iron Sputtering Target, Fe”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top