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KF Flanged TFM Auto-Soft Start Valve (Flow Actuated)

KF Flanged TFM Auto-Soft Start Valve (Flow Actuated)

This valve serves as a replacement for a KF centering ring, simplifying installation and effectively managing the throttling of roughing pumps during their initial evacuation. As the roughing pump starts, the initial flow causes the vane assembly to close, automatically throttling the pump. The valve then opens automatically once a predetermined pressure differential is achieved.

Features

  • Durable Construction: Made from 304 stainless steel with an Elgiloy® spring for enhanced longevity.
  • High-Temperature Resistance: Maximum operating temperature of 100°C.
  • Reduced Turbulence: Minimizes turbulence in the system by lowering the initial pumping speed, which is crucial for sensitive applications.
  • Particle Sensitivity: Ideal for environments where particle disruption is critical, such as semiconductor and thin film processes.
  • Vent Valve Compatibility: Can be used with vent valves to prevent extreme pressure differentials and reduce turbulence during system venting.
  • Substrate Protection: Helps prevent damage to substrates during operation.
  • Cost-Effective Solution: Replaces costly pressure control bypass valves, offering an efficient alternative.
  • Rapid Vane Closure: Achieves fast action with a closing time of 12 ms or better during testing.
  • No Electrical Power Required: Operates independently of electrical systems, ensuring reliability.

Note: Using the soft start check valve can increase typical pump-down time by 3X. Test times are based on a 27 CFM pump evacuating a 100-liter volume, with results varying by system configuration.

Specifications Table

ManufacturerTFM
RatesClosing Flow
6.00 CFM
2.80 L/s
Opening Pressure
2.67 mbar
2.00 Torr
TemperatureBakeable
100 ºC
212 ºF
Actuator
Type
Spring
Spring
Material
Elgiloy
Bearing
Material
Teflon
Vane
Material
Inconel 625
Valve Body
Material
304L SS
Valve Seal
Material
Viton

Ordering Table

Flange Size Closing Time (sec.) Required Clearance Part Number
KF40 (2.16" OD) 0.01 0.7 225-0040
KF50 (2.95" OD) 0.012 1 225-0050

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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