Introduction to (La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇ Sputtering Target
The (La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇ Sputtering Target is a high-entropy oxide (HEO) material that integrates multiple rare earth elements into a single zirconate pyrochlore structure. By incorporating lanthanum (La), cerium (Ce), gadolinium (Gd), yttrium (Y), and erbium (Er) in equal proportions (20% each), this target material offers exceptional compositional complexity and functional tunability, making it highly attractive for advanced thin-film deposition applications.
Material Structure and Stability
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Crystal Phase: This compound typically crystallizes into a defect-fluorite or pyrochlore-type structure, known for its high structural stability and tolerance to cation disorder.
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High-Entropy Effect: The equimolar distribution of five different rare earth cations contributes to strong lattice distortion and configurational entropy, improving thermal stability, radiation resistance, and ionic transport properties.
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Zirconate Backbone (Zr₂O₇): Zirconium oxide provides excellent chemical inertness, high melting point, and stability against phase degradation, serving as a robust matrix for rare earth incorporation.
Key Features
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Enhanced Thermal Stability: The multi-cation design minimizes phase transitions under high-temperature conditions, ensuring uniform film growth.
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Radiation and Corrosion Resistance: The disordered pyrochlore lattice offers superior resistance to radiation damage and harsh chemical environments, making it ideal for protective coatings.
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Tunable Functional Properties: Depending on deposition parameters, the sputtered films can exhibit tailored electrical, optical, and ionic conductivity properties.
Applications
The (La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇ sputtering target is widely used in research and emerging technologies where multifunctional oxide films are required. Applications include:
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Thin-Film Coatings – Fabrication of complex oxide coatings with tailored dielectric and optical properties.
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Energy Storage and Conversion – Potential use in solid oxide fuel cells (SOFCs) and oxygen transport membranes due to enhanced ionic conductivity.
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Protective Coatings – High-temperature and corrosion-resistant films for aerospace and turbine applications.
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Nuclear Materials – Radiation-tolerant coatings suitable for nuclear waste immobilization or advanced nuclear fuel cladding.
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Optoelectronics – Transparent conductive or functional oxide layers in display and sensor technologies.
Fabrication & Deposition
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Sputtering Method: Compatible with RF magnetron sputtering and pulsed DC sputtering systems.
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Film Characteristics: Depending on parameters (substrate temperature, atmosphere, power density), films may show high density, smooth morphology, and tailored bandgap properties.
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Target Preparation: Usually produced by solid-state sintering or hot-pressing methods to achieve high density (>95% of theoretical) and uniform microstructure.
| Order Now | (La₀.₂Ce₀.₂Gd₀.₂Y₀.₂Er₀.₂)Zr₂O₇ target 99.95% ø50.8×3.18mm |
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FAQ
What is a sputtering target?
It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.
What materials are used to make sputtering targets?
Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.
How are sputtering targets manufactured?
They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.
How does sputter deposition work with these targets?
In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.
What factors affect the life and performance of a sputtering target?
Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.
How do I know when a sputtering target needs to be replaced?
Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.
Why do some sputtering targets need to be bonded to backing plates?
Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.
What is the difference between DC and RF sputtering for targets?
DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.
How does reactive sputtering differ from standard sputtering?
In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.
Can I use customer-supplied powders to make sputtering targets?
Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.
What storage and handling procedures are recommended for sputtering targets?
Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.
What key parameters affect sputtering deposition rates?
Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).
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