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VD0698 Lanthanum Calcium Manganate Evaporation Materials, La0.67Ca0.33MnO3

Catalog No.VD0698
MaterialLanthanum Calcium Manganate
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a leading manufacturer and supplier of high purity lanthanum calcium manganate evaporation materials, as well as a broad range of other evaporation materials. Our lanthanum calcium manganate materials are available in both powder and granule forms. We also offer customized forms to meet specific requirements upon request.

 

MSDS File

Lanthanum Calcium Manganate Evaporation Materials Overview

TFM provides high purity lanthanum calcium manganate evaporation materials, featuring the chemical formula La₀.₆₇Ca₀.₃₃MnO₃. These oxide evaporation materials are essential for ensuring high-quality films in various deposition processes. Our lanthanum calcium manganate materials are produced to an exceptional purity level of up to 99.9995%, with stringent quality assurance protocols to ensure their reliability.

Related Products: Lanthanum Evaporation Materials, Calcium Evaporation Materials, Manganese Evaporation Materials, Oxide Ceramic Evaporation Materials

Applications

Lanthanum calcium manganate evaporation materials are ideal for:

  • Deposition processes including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics applications, such as wear protection, decorative coatings, and displays.

Packaging

Our lanthanum calcium manganate evaporation materials are meticulously tagged and labeled to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Contact Us

TFM is a leading provider of high purity lanthanum calcium manganate evaporation materials. We offer our products in various forms, including tablets, granules, rods, and wires, with customized options available upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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