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ST0159B Lanthanum Calcium Manganate Sputtering Targets (La0.7Ca0.3MnO3)

MSDS File
Material TypeLanthanum Calcium Manganate
SymbolLa0.7Ca0.3MnO3, LCMO
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Relative Density (g/cc)>90%
Z RatioN/A
SputterRF, RF-R, DC
Max Power Density*
(Watts/Square Inch)		N/A
Type of BondIndium, Elastomer

Lanthanum Calcium Manganate Sputtering Targets (La₀.₇Ca₀.₃MnO₃)

Overview

Lanthanum Calcium Manganate (La₀.₇Ca₀.₃MnO₃), also referred to as LCMO, is a unique ceramic oxide material with exceptional properties. This compound is highly valued for its application in various advanced technologies due to its magnetic and electronic characteristics. Lanthanum Calcium Manganate exhibits a transition temperature that increases with electron irradiation, maintaining magnetic polarons at higher temperatures. This makes it an excellent choice for applications in antimicrobial drugs, fuel cells, metal-air batteries, and water purification technologies. Though noncombustible, it is a strong oxidizing agent sensitive to oxygen levels.

Lanthanum Calcium Manganate Sputtering Targets Information

  • Purity: 99.9%
  • Available Shapes:
    • Circular: Diameter ≤ 14 inches, Thickness ≤ 15 mm
    • Block: Length ≤ 120 ± 0.1 mm, Width ≤ 120 ± 0.1 mm, Thickness ≤ 15 mm
  • Bonding: Indium, Elastomer
  • Sputtering Options: RF, RF-R, DC
  • Target Characteristics: Due to the material’s brittleness and low thermal conductivity, bonding is recommended. Special ramp-up and ramp-down procedures may be required during sputtering to prevent thermal shock.

Applications of Lanthanum Calcium Manganate Sputtering Targets

  • Catalysts
  • Superconducting Materials
  • Solid Oxide Fuel Cell Cathodes
  • Supercapacitors
  • Ferroelectric Storage

Features

  • High Purity & Density: Ensures superior material quality for reliable results.
  • Custom Sizes Available: Tailored to meet specific requirements.
  • Single Phase Composition: Guarantees consistent material properties.

Manufacturing Process

  • Powder Synthesis: In-house high-purity metal oxide precursor materials are used for optimal quality.
  • High-Energy Mixing & Particle Sizing: Ensures uniform consistency in the sputtering target.
  • Densification & Sintering: Multi-step processes to enhance target density and material integrity.
  • Cleaning & Packaging: Cleaned for vacuum use and carefully packaged to protect against contamination during shipment.

Options Available

  • Purity: 99.9% minimum purity ensures consistent, high-quality targets.
  • Custom Compositions: Available upon request for specialized applications.
  • Smaller Sizes for R&D: Perfect for research and development needs.
  • Sputtering Target Bonding Service: Available for improved target reliability and performance.

For more details or to inquire about custom requirements, please contact us.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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