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ST0159B Lanthanum Calcium Manganate Sputtering Targets (La0.7Ca0.3MnO3)

Introduction

Lanthanum Calcium Manganate sputtering targets are advanced perovskite oxide materials widely used in functional thin-film research and oxide electronics. By partially substituting lanthanum with calcium, this manganite system exhibits tunable electrical conductivity and magnetic behavior, making it highly valuable for spintronic devices, magnetoresistive components, and correlated-electron oxide studies. These targets provide a stable and reproducible material source for high-quality oxide thin-film deposition.

Detailed Description

Lanthanum Calcium Manganate, typically expressed as La₁₋ₓCaₓMnO₃, is a mixed-valence manganese oxide with a perovskite crystal structure. Calcium substitution modifies the Mn³⁺/Mn⁴⁺ ratio, directly influencing charge transport, magnetic ordering, and phase behavior. This compositional flexibility allows researchers to tailor film properties for specific electronic and magnetic functions.

Our Lanthanum Calcium Manganate sputtering targets are manufactured from high-purity oxide precursors using carefully controlled solid-state synthesis and high-temperature sintering processes. The resulting targets feature high density, uniform composition, and good mechanical integrity, which are essential for stable sputtering rates and consistent film stoichiometry.

These ceramic targets are compatible with RF sputtering and pulsed-DC sputtering systems commonly used for complex oxide deposition. Planar disc targets are available in standard diameters, with optional bonding to copper or other backing plates to enhance heat dissipation and reduce thermal stress during operation. Custom compositions, calcium doping levels, dimensions, and bonding solutions can be supplied to support both research and pilot-scale production.

Applications

Lanthanum Calcium Manganate sputtering targets are primarily used in:

  • Magnetoresistive and spintronic thin films

  • Oxide electronics and correlated electron systems

  • Magnetic sensors and functional magnetic layers

  • Electrodes and buffer layers in oxide heterostructures

  • Perovskite oxide research and development

  • Academic and industrial thin-film R&D

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaLa₁₋ₓCaₓMnO₃Defines electrical & magnetic behavior
Purity99.9% – 99.99%Reduces impurity-related defects
Ca Doping (x)0.1 – 0.4 (custom)Tunes conductivity and magnetism
Crystal StructurePerovskite oxideEnables functional properties
Diameter1″ – 4″ (custom available)Fits standard sputtering cathodes
Thickness3 – 6 mmInfluences target lifetime
Density≥ 95% of theoreticalEnsures stable sputtering performance
Backing PlateOptional Cu / AlImproves thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Lanthanum Calcium ManganateTunable magnetic & electronic propertiesSpintronics, magnetoresistance
Lanthanum Strontium ManganateHigher conductivityOxide electrodes, spintronics
Lanthanum ManganateInsulating, antiferromagneticFundamental oxide studies
Strontium RuthenateMetallic oxide electrodeFerroelectric thin films

FAQ

QuestionAnswer
Can the calcium content be customized?Yes, Ca doping levels can be tailored to specific requirements.
Is RF sputtering required?Yes, RF or pulsed-DC sputtering is recommended for this ceramic target.
Do you offer bonded targets?Yes, indium-bonded or elastomer-bonded options are available.
What density can be achieved?Typical density exceeds 95% of theoretical density.

Packaging

Our Lanthanum Calcium Manganate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each target is vacuum-sealed and protected with shock-absorbing materials to prevent damage or contamination during storage and transportation.

Conclusion

Lanthanum Calcium Manganate sputtering targets offer reliable composition control, high density, and stable sputtering behavior for advanced magnetic and electronic oxide thin films. With flexible doping options and robust manufacturing quality, they are an excellent choice for research and specialized device fabrication.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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