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ST0159A Lanthanum Calcium Manganate Sputtering Targets (La0.5Ca0.5MnO3)

MSDS File
Material TypeLanthanum Calcium Manganate
SymbolLa0.5Ca0.5MnO3, LCMO
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Relative Density (g/cc)>90%
Z RatioN/A
SputterRF, RF-R, DC
Max Power Density*
(Watts/Square Inch)		N/A
Type of BondIndium, Elastomer

Lanthanum Calcium Manganate Sputtering Targets (La₀.₅Ca₀.₅MnO₃)

Overview

Lanthanum Calcium Manganate (La₀.₅Ca₀.₅MnO₃), also known as LCMO, is a versatile material used in various advanced technological applications. This compound exhibits unique properties, such as a transition temperature that increases with high doses of electron irradiation, which allows magnetic polarons to persist at elevated temperatures. It is used in applications such as antimicrobial drugs, fuel cells, metal-air batteries, and water purification technology. While noncombustible, LCMO is a powerful oxidizing agent sensitive to oxygen levels.

Lanthanum Calcium Manganate Sputtering Targets Information

  • Purity: 99.9%
  • Available Shapes:
    • Circular: Diameter ≤ 14 inches, Thickness ≤ 15 mm
    • Block: Length ≤ 120 ± 0.1 mm, Width ≤ 120 ± 0.1 mm, Thickness ≤ 15 mm
  • Bonding: Indium, Elastomer
  • Sputtering Options: RF, RF-R, DC
  • Target Characteristics: Many sputtering targets, such as Lanthanum Calcium Manganate, require bonding due to their brittleness or low thermal conductivity. A special ramp-up and ramp-down procedure may be necessary to avoid thermal shock during sputtering.

Applications of Lanthanum Calcium Manganate Sputtering Targets

  • Catalysts
  • Superconducting Materials
  • Solid Oxide Fuel Cell Cathodes
  • Supercapacitors
  • Ferroelectric Storage

Features

  • High Purity & Density: Ensures superior performance and quality.
  • Custom Sizes Available: Tailored solutions for specific project requirements.
  • Single Phase Composition: Reliable consistency in material properties.

Manufacturing Process

  • Powder Synthesis: In-house high-purity metal oxide precursor materials used.
  • High-Energy Mixing & Particle Sizing: Ensures uniform distribution for optimal performance.
  • Densification & Sintering: Multiple-step processes for enhanced material properties.
  • Cleaning & Packaging: Targets are cleaned for vacuum use and protected during shipment to avoid environmental contamination.

Options Available

  • Purity: 99.9% minimum purity ensures consistent, high-quality targets.
  • Custom Compositions: Available upon request for specialized applications.
  • Smaller Sizes for R&D: Perfect for research and development purposes.
  • Sputtering Target Bonding Service: Available to ensure optimal performance and reliability.

For more information or to inquire about specific requirements, feel free to contact us.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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