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lanthanum-manganate-evaporation-materials

VD0699 Lanthanum Manganate Evaporation Materials, LaMnO3

Catalog No.VD0699
MaterialLanthanum Manganate (LaMnO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high purity lanthanum manganate evaporation materials, along with a diverse range of other evaporation materials. Our lanthanum manganate materials are available in both powder and granule forms, and we can provide customized options to meet specific needs upon request.

 

MSDS File

Lanthanum Manganate Evaporation Materials Overview

TFM offers high purity lanthanum manganate evaporation materials with the chemical formula LaMnO₃. These oxide evaporation materials are essential for achieving high-quality films in various deposition processes. We specialize in producing lanthanum manganate materials with purity levels up to 99.9995%, ensuring top-notch product reliability through rigorous quality assurance processes.

Related Products: Lanthanum Evaporation Materials, Manganese Evaporation Materials

Applications

Lanthanum manganate evaporation materials are utilized in:

  • Deposition processes including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics applications such as wear protection, decorative coatings, and displays.

Packaging

Our lanthanum manganate evaporation materials are carefully tagged and labeled to ensure efficient identification and quality control. We take extensive measures to prevent damage during storage and transportation.

Contact Us

TFM is a leading supplier of high-purity lanthanum manganate evaporation materials, available in various forms including tablets, granules, rods, and wires. Customized shapes and quantities are also available upon request. We also offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about other materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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