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Lanthanum Sputtering Target

ST0024 Lanthanum Sputtering Target, La

Chemical Formula: La
Catalog Number: ST0024
CAS Number: 7439-91-0
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Sputtering Target Description

Lanthanum

The lanthanum sputtering target is a solid target made from high-purity lanthanum metal. Lanthanum, symbolized as “La” with an atomic number of 57, is a soft, malleable, and silvery-white metal. It is one of the most reactive rare earth elements. Lanthanum is used to make special optical glasses and to enhance the malleability of steel. Additionally, lanthanum is valuable in wastewater treatment and oil refining. Due to its application in photoconversion films, scientists have nicknamed lanthanum “super calcium.”

Lanthanum Sputtering Target Specification

Material TypeLanthanum
SymbolLa
Color/AppearanceSolid
Melting Point 927 °C
Type of Bond/
Density7.3 g/cc
Thermal Conductivity6.17 W/m.K
Coefficient of Thermal Expansion12.1 x 10-6/K
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 12.1  0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Lanthanum Sputtering Target Application

The lanthanum sputtering target is used for thin film deposition in applications such as decoration, semiconductors, displays, LEDs, photovoltaic devices, functional coatings, optical information storage, glass coatings (including car and architectural glass), and optical communication.

Major applications of lanthanum include:

  • As an alloying agent for steels and cast irons
  • In hybrid car batteries
  • In cigarette lighter flints as Mischmetal (an alloy primarily consisting of cerium and lanthanum)
  • In carbon arc lighting used in motion pictures, studio lighting, and projection

Handling Notes

  1. Bonding services for lanthanum sputtering targets are currently unavailable.
  2. Due to its high chemical activity, lanthanum sputtering targets require oil packaging and thorough cleaning to prevent environmental reactions.

Packaging

Our Lanthanum Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Lanthanum Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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La 3N ø50.8*3.18mm, La 3N ø50.8*3mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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