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VD0703 Lanthanum Titanate Evaporation Materials, LaTiO3

Catalog No.VD0703
MaterialLanthanum Titanate (LaTiO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) excels in manufacturing and supplying high-purity lanthanum titanate evaporation materials. Our extensive range of evaporation materials is available in both powder and granule forms, with custom options provided to meet specific requirements. We are committed to delivering top-quality products to support a wide range of applications.

MSDS File

Lanthanum Titanate Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) provides high-purity lanthanum titanate evaporation materials with the chemical formula LaTiO₃. These materials are crucial for ensuring superior quality in deposition processes. We specialize in producing lanthanum titanate with purity levels up to 99.9995%, employing rigorous quality assurance processes to ensure reliability and performance.

Related Products: Lanthanum Evaporation Materials, Titanium Evaporation Materials, Oxide Ceramic Evaporation Materials

Applications

Lanthanum titanate evaporation materials are used in:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our lanthanum titanate evaporation materials are carefully tagged and labeled to facilitate efficient identification and quality control. We ensure that all products are protected from damage during storage and transportation.

Contact Us

At Thin-Film Mat Engineering (TFM), we offer high-purity lanthanum titanate evaporation materials in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. Additionally, we supply a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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