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Lanthanum Trifluoride Evaporation Materials

VD0784 Lanthanum Trifluoride Evaporation Materials, LaF3

Catalog No.VD0784
MaterialLanthanum fluoride (LaF3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands as a top-tier manufacturer and supplier of premium-quality lanthanum fluoride evaporation materials. In addition to lanthanum fluoride, we offer an extensive range of evaporation materials to suit diverse needs. Our products are available in both powder and granule forms, ensuring flexibility for various applications. For specialized requirements, we also provide custom formulations tailored to meet your unique specifications.

MSDS File

Lanthanum Trifluoride Evaporation Materials Overview

Lanthanum trifluoride (LaF3) is a high-purity fluoride ceramic material utilized in evaporation processes. This compound plays a crucial role in ensuring the quality of deposited films. TFM is renowned for its expertise in producing LaF3 with exceptional purity levels, up to 99.9995%, thanks to rigorous quality control measures.

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Lanthanum Trifluoride Evaporation Materials Specification

Material TypeLanthanum Trifluoride
SymbolLaF3
Appearance/ColorWhite crystalline powder
Melting Point1,493 °C (2,719 °F; 1,766 K)[
Density5.9 g/cm3
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Lanthanum Trifluoride Evaporation Materials Application

Lanthanum trifluoride is used extensively in various deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). Its primary applications are in optics for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Lanthanum trifluoride evaporation materials are meticulously labeled for easy identification and quality control. Packaging is designed to prevent damage during storage and transportation.

Contact Information

TFM is a leading supplier of high-purity lanthanum trifluoride evaporation materials, offering a range of forms such as tablets, granules, rods, and wires. We also provide custom solutions to meet specific needs. In addition, TFM offers evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about products not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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