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ST0165 Lanthanum Vanadium Oxide Sputtering Target, LaVO3

Chemical Formula: LaVO3
Catalog Number: ST0165
CAS Number: 12142-65-3
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Vanadium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Lanthanum Vanadium Oxide (LaVO₃) Sputtering Targets are specialized ceramic targets used in thin film deposition for advanced electronic, magnetic, and oxide semiconductor applications. As a perovskite-type oxide material, LaVO₃ exhibits unique electronic correlations, tunable conductivity, and interesting magnetic properties, making it highly valuable for research in oxide electronics and functional thin films.

In magnetron sputtering processes, LaVO₃ sputtering targets enable the deposition of complex oxide thin films with controlled composition and crystal structure. These films are widely used in materials science research, oxide heterostructures, and next-generation electronic devices.

Detailed Description

Lanthanum Vanadium Oxide (LaVO₃) is a strongly correlated oxide belonging to the ABO₃ perovskite structure family. In this structure, lanthanum occupies the A-site while vanadium resides in the B-site of the perovskite lattice. This crystal structure allows the material to exhibit interesting electronic behaviors, including Mott insulating characteristics and temperature-dependent electrical conductivity.

LaVO₃ thin films are often studied for their electronic phase transitions and strong electron–electron interactions. These properties make them an important material for exploring novel electronic states and oxide-based device architectures. When deposited using sputtering techniques, LaVO₃ can form high-quality epitaxial or polycrystalline films depending on the substrate and deposition conditions.

High-density LaVO₃ sputtering targets are typically manufactured using advanced ceramic processing methods such as solid-state reaction, hot pressing, or sintering. These processes ensure uniform composition, high density, and stable sputtering behavior. High-density targets help maintain consistent sputtering rates and minimize particle generation during deposition.

Because oxide thin films are sensitive to stoichiometry, maintaining precise composition in the sputtering target is critical. A well-controlled LaVO₃ target ensures that the deposited thin films retain the desired electronic and structural characteristics. The targets can also be supplied with optional backing plates—such as copper or titanium—to improve thermal conductivity and mechanical stability during high-power sputtering.

Lanthanum Vanadium Oxide sputtering targets are commonly used in research laboratories and advanced thin film fabrication environments where oxide materials with complex electronic behavior are required.

Applications

Lanthanum Vanadium Oxide sputtering targets are primarily used in advanced materials research and functional oxide thin film fabrication. Typical applications include:

  • Oxide electronics research involving strongly correlated materials

  • Thin film heterostructures in complex oxide systems

  • Mott insulator and transition metal oxide studies

  • Spintronic and magnetic oxide devices

  • Functional oxide coatings for electronic components

  • Research on perovskite oxide interfaces and superlattices

These applications make LaVO₃ an important material in modern condensed matter physics and advanced electronic materials research.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity improves film quality and reduces defects
CompositionLaVO₃ (Perovskite oxide)Maintains correct stoichiometry for oxide thin films
Density≥ 95% theoretical densityEnsures stable sputtering and uniform deposition
Diameter25 – 200 mm (custom available)Compatible with various sputtering systems
Thickness3 – 6 mmInfluences sputtering lifetime and stability
BondingCopper / Titanium backing plate optionalImproves heat dissipation during sputtering

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Lanthanum Vanadium Oxide (LaVO₃)Strongly correlated electronic behaviorOxide electronics research
Lanthanum Nickel Oxide (LaNiO₃)Metallic conductivityConductive oxide electrodes
Strontium Vanadate (SrVO₃)High electrical conductivityOxide electronics and electrodes
Lanthanum Manganite (LaMnO₃)Magnetic and catalytic propertiesMagnetic oxide films

FAQ

QuestionAnswer
Can LaVO₃ sputtering targets be customized?Yes, diameter, thickness, density, and bonding options can be customized to fit different sputtering systems.
What sputtering methods are suitable for LaVO₃ targets?They are typically used in RF magnetron sputtering systems for oxide thin film deposition.
Why is stoichiometry important for LaVO₃ targets?Maintaining the correct La:V ratio ensures that deposited thin films retain the desired electronic and structural properties.
What substrates are commonly used for LaVO₃ thin films?Substrates such as SrTiO₃, LaAlO₃, sapphire, and silicon are frequently used.
Are bonded targets available?Yes, targets can be bonded to copper or titanium backing plates to improve thermal stability during sputtering.

Packaging

Our Lanthanum Vanadium Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Lanthanum Vanadium Oxide (LaVO₃) sputtering targets provide a reliable material source for the deposition of complex oxide thin films with unique electronic and magnetic properties. Their perovskite structure and strongly correlated electron behavior make them an essential material for oxide electronics, condensed matter physics research, and advanced thin film engineering.

With customizable dimensions, high purity levels, and optional backing plate configurations, LaVO₃ sputtering targets support both research-scale experiments and industrial thin film deposition systems.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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