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VD0558 Lead Evaporation Materials, Pb

Material Type: Lead
Symbol: Pb
Purity: 99.9% ~ 99.99%
Shape: Powder/ Granule/ Custom-made

TFM is a leading producer and supplier of high-purity lead evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, with customization options available to meet specific requirements.

MSDS File

Lead Evaporation Material Description

Lead is a dense, heavy metal known for its softness, malleability, and relatively low melting point. When freshly cut, it has a silvery appearance with a hint of blue but tarnishes to a dull gray over time. Lead holds the highest atomic number among stable elements, and three of its isotopes serve as endpoints in significant nuclear decay chains of heavier elements.

High-purity lead evaporation materials are essential for achieving excellent results in deposition processes, leading to the creation of high-quality thin films. At TFM, we specialize in producing lead evaporation materials with purity levels up to 99.99%, supported by rigorous quality assurance procedures to ensure the reliability and performance of our products.

lead evaporation materials

Lead Evaporation Material Specification

Material TypeLead
SymbolPb
Color/AppearanceBluish White, Metallic
Melting Point328 °C
Density11.34 g/cc
Thermal Conductivity35 W/m.K
Coefficient of Thermal Expansion28.9 x 10-6/K
SynonymsPb Pellets, Pb Pieces, Pb Evaporation Pellet, Lead Pellets, Lead Pieces, Lead Evaporation Pellet

Lead Evaporation Material Application

Lead evaporation materials are utilized in various deposition processes, including semiconductor fabrication, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). These techniques are essential for producing high-quality thin films used in advanced technologies. In optics, lead materials are employed for wear protection, decorative coatings, and enhancing display technologies.

Lead Evaporation Material Packaging

We carefully handle our lead evaporation materials to prevent damage during storage and transportation, ensuring that the quality and original condition of our products are preserved.

Ordering Table

Material Size Quantity Purity Part Number
Lead 1mm - 4mm Shot 100 g 99.999% EVMPB503MMD
Lead 1mm - 4mm Shot 200 g 99.999% EVMPB503MMH
Lead 1mm - 4mm Shot 1 kg 99.999% EVMPB503MMKG
Lead 1mm - 4mm Shot 500 g 99.999% EVMPB503MMT

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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