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ST0281 Lead Sulfide Sputtering Target, PbS

Chemical Formula: PbS
Catalog Number: ST0281
CAS Number: 1314-87-0
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Lead Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lead Sulfide Sputtering Target Description

The lead sulfide sputtering target is a type of sulfide ceramic sputtering material composed of lead and sulfur. It is commonly used in various thin film deposition applications, including those in the semiconductor, photovoltaic, and display industries. This material is also utilized for functional coatings and other specialized applications in the optical communication and glass coating sectors.

leadLead, also known as plumbum, is a chemical element with the symbol “Pb” derived from the Latin word for lead, “plumbum.” It has been used since ancient times, with its earliest known use around 7000 BC by people from the Near East. Lead has an atomic number of 82 and is located in Period 6 and Group 14 of the periodic table, which places it in the p-block of elements. The relative atomic mass of lead is approximately 207.2 Daltons, with the number in brackets indicating the uncertainty of the measurement.

Related Product: Lead Sputtering Target

SulfurSulfur, also spelled sulphur, is a chemical element with the symbol “S” and atomic number 16. The name sulfur is derived from the Sanskrit word ‘sulvere’ or the Latin ‘sulfurium,’ both referring to sulfur. It has been known and used since before 2000 BC, with its early discovery attributed to ancient Chinese and Indian civilizations. Sulfur is located in Period 3 and Group 16 of the periodic table, placing it in the p-block. The relative atomic mass of sulfur is approximately 32.065 Daltons, with the number in brackets indicating the uncertainty of the measurement.

Lead Sulfide Sputtering Target Specification

Compound FormulaPbS
AppearanceSolid
Melting Point1118 °C
Density7.5 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lead Sulfide Sputtering Target Application

The lead sulfide sputtering target is utilized for various applications, including thin film deposition, decorative coatings, and semiconductor manufacturing. It is also employed in the production of displays, LEDs, and photovoltaic devices. Additionally, lead sulfide targets are used for functional coatings and are important in industries related to optical information storage, such as car glass and architectural glass coatings, as well as optical communication.

Lead Sulfide Sputtering Target Packing

Our lead sulfide sputter targets are meticulously tagged and labeled externally to guarantee accurate identification and maintain high-quality standards. We take extensive precautions to prevent any potential damage during storage or transportation, ensuring that the products remain in pristine condition upon delivery.

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TFM offers Lead Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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