Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Lead(II) Titanate Evaporation Materials

VD0706 Lead(II) Titanate Evaporation Materials, PbTiO3

Catalog No.VD0706
MaterialLead Titanate (PbTiO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) specializes in manufacturing and supplying high-purity lead(II) titanate evaporation materials. Our extensive range includes both powder and granule forms, with custom options available to meet specific needs. We are committed to providing top-quality materials to ensure superior performance in a variety of deposition applications.

MSDS File

Introduction

Lead(II) Titanate Evaporation Materials (PbTiO₃) are advanced perovskite oxide compounds used in the fabrication of ferroelectric and piezoelectric thin films. As a well-known ferroelectric material with a high Curie temperature (~490°C), PbTiO₃ is widely applied in non-volatile memory research, microelectromechanical systems (MEMS), sensors, and actuator technologies.

In vacuum deposition systems, PbTiO₃ evaporation materials enable the formation of functional oxide layers with strong spontaneous polarization and dielectric performance. Careful control of composition and oxygen environment is essential to maintain film stoichiometry and phase purity.

Detailed Description

PbTiO₃ is a tetragonal perovskite structured oxide composed of lead (Pb) and titanium (Ti) in a 1:1 atomic ratio. Due to the relatively high vapor pressure of lead at elevated temperatures, precise material preparation and deposition control are critical to avoid lead deficiency during evaporation.

Evaporation materials are typically supplied as:

  • Sintered ceramic pellets

  • Granules

  • Pressed tablets

  • Custom-cut pieces compatible with crucibles

Manufacturing emphasizes:

  • High phase purity to avoid secondary phases (e.g., PbO segregation)

  • Controlled density (≥95% theoretical)

  • Homogeneous microstructure for stable evaporation

  • Optimized stoichiometry compensation if required

PbTiO₃ evaporation materials are generally used in electron beam evaporation systems, often under controlled oxygen partial pressure to maintain proper oxidation states. In some processes, co-evaporation with excess PbO is applied to compensate for lead volatility.

Deposited PbTiO₃ thin films typically exhibit:

  • Strong ferroelectric polarization

  • High dielectric constant

  • Good piezoelectric response

  • Structural compatibility with perovskite substrates

These properties make PbTiO₃ a foundational material in ferroelectric device engineering.

Applications

Lead(II) Titanate Evaporation Materials are widely used in:

  • Ferroelectric memory devices (FeRAM research)

  • Piezoelectric thin film actuators

  • MEMS sensors and micro-actuators

  • Perovskite oxide heterostructures

  • Capacitor and dielectric layer research

  • Spintronic and multiferroic material development

  • Academic and advanced R&D laboratories

PbTiO₃ is often integrated with related perovskite materials such as PZT (lead zirconate titanate) systems for enhanced electromechanical performance.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaPbTiO₃Defines ferroelectric perovskite structure
Purity99.9% – 99.99%Ensures phase stability & electrical performance
FormPellets / Granules / PiecesCompatible with evaporation sources
Density≥ 95% theoreticalImproves evaporation consistency
Deposition MethodE-beam (with O₂ control)Maintains stoichiometry
Curie Temperature~490°CDefines ferroelectric operating range

Custom pellet sizes and stoichiometry adjustments can be provided for specific research requirements.

Comparison with Related Ferroelectric Materials

MaterialKey AdvantageTypical Application
PbTiO₃High Curie temperature & strong polarizationFerroelectric thin films
PZT (Pb(Zr,Ti)O₃)Enhanced piezoelectric performanceActuators & sensors
BaTiO₃Lead-free ferroelectricCapacitors & dielectric layers
BiFeO₃Multiferroic behaviorSpintronic research

Compared to BaTiO₃, PbTiO₃ offers higher Curie temperature and stronger tetragonal distortion, contributing to robust ferroelectric performance.

FAQ

QuestionAnswer
Is oxygen control required during deposition?Yes, maintaining oxygen partial pressure is critical for proper film stoichiometry.
Can lead volatility affect film composition?Yes, process optimization or slight composition compensation may be necessary.
Is e-beam evaporation recommended?Yes, electron beam evaporation is typically preferred for controlled deposition.
Can custom pellet sizes be supplied?Yes, sizes and forms can be tailored to your equipment.
Are certificates available?Yes, chemical composition and batch traceability documentation can be provided.

Packaging

Our Lead(II) Titanate Evaporation Materials are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. Materials are carefully vacuum-sealed or packed in moisture-resistant containers to maintain integrity during storage and transportation.

Conclusion

Lead(II) Titanate Evaporation Materials (PbTiO₃) provide a reliable source for high-performance ferroelectric and piezoelectric thin films. With controlled purity, stable evaporation characteristics, and customizable configurations, they support advanced research and device development in functional oxide electronics.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Reviews

There are no reviews yet.

Be the first to review “VD0706 Lead(II) Titanate Evaporation Materials, PbTiO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

Shopping Cart
Scroll to Top