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Lead(II) Titanate Evaporation Materials

VD0706 Lead(II) Titanate Evaporation Materials, PbTiO3

Catalog No.VD0706
MaterialLead Titanate (PbTiO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) specializes in manufacturing and supplying high-purity lead(II) titanate evaporation materials. Our extensive range includes both powder and granule forms, with custom options available to meet specific needs. We are committed to providing top-quality materials to ensure superior performance in a variety of deposition applications.

MSDS File

Lead(II) Titanate Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) offers high-purity lead(II) titanate evaporation materials, with the chemical formula PbTiO₃. These materials are crucial for producing high-quality films in various deposition processes. We specialize in providing lead(II) titanate with purity levels up to 99.9995%, ensuring exceptional reliability through rigorous quality assurance methods.

Related Products: Lead Evaporation Materials, Titanium Evaporation Materials, Oxide Ceramic Evaporation Materials

Lead(II) Titanate Evaporation Materials Specification

Material TypeLead(II) titanate
SymbolPbTiO3
Color/AppearanceYellow
Theoretical Density 9.53 g/cm3
Purity99.5% ~ 99.99%
Other NamesLead(II) titanate
Lead titanium oxide
Lead(II) titanium oxide
ShapePowder/ Granule/ Custom-made

Applications

Lead(II) titanate evaporation materials are used in:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Utilized for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our lead(II) titanate materials are clearly tagged and labeled for efficient identification and quality control. We ensure that the materials are handled with care to prevent any damage during storage and transportation.

Contact Us

At Thin-Film Mat Engineering (TFM), we provide high-purity lead(II) titanate evaporation materials in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. We also offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional inquiries, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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