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ST0168 Lead Zirconate Sputtering Target, PbZrO3

Chemical Formula: PbZrO3
Catalog Number: ST0168
CAS Number: 12060-01-4
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lead Zirconate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lead Zirconate Sputtering Target Description

The Lead Zirconate Sputtering Target from TFM is an oxide sputtering material composed of lead (Pb), zirconium (Zr), and oxygen (O).

leadLead, also known as plumbum, is a chemical element with the symbol “Pb,” derived from the Latin word “plumbum.” It has been used since around 7000 BC, with its discovery attributed to ancient civilizations in the Near East. Lead has an atomic number of 82 and is situated in Period 6, Group 14 of the periodic table, within the p-block. Its relative atomic mass is 207.2(1) Dalton, with the number in brackets indicating the measurement uncertainty. Lead is characterized by its high density, malleability, and resistance to corrosion, making it useful in various applications including batteries, radiation shielding, and pigments.

Related Product: Lead Sputtering Target

ZirconiumZirconium is a chemical element named after the Persian word ‘zargun,’ meaning gold-colored. It was first mentioned and observed by H. Klaproth in 1789, with its isolation later accomplished and announced by J. Berzelius. The chemical symbol for zirconium is “Zr,” and its atomic number is 40. Zirconium is located in Period 5, Group 4 of the periodic table, within the d-block. Its relative atomic mass is 91.224(2) Dalton, with the number in brackets indicating the measurement uncertainty. Zirconium is known for its strong resistance to corrosion and is widely used in nuclear reactors, chemical processing equipment, and as an alloying agent in various applications.

Related Product: Zirconium Sputtering Target

OxygenOxygen is a chemical element named after the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is essential for respiration in most life forms and is a key component in combustion, oxidation, and numerous chemical processes.

Lead Zirconate Sputter Target Handling Notes

  • Indium Bonding: Indium bonding is recommended for the lead zirconate sputtering target due to its brittleness and low thermal conductivity, which make it less suitable for traditional sputtering methods.
  • Thermal Conductivity: This material has low thermal conductivity and is susceptible to thermal shock. Proper handling and bonding techniques are essential to prevent damage during the sputtering process.

Lead Zirconate Sputter Target Application

The Lead Zirconate Sputtering Target is used in a variety of applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also valuable in functional coatings, the optical information storage industry, glass coatings for automotive and architectural purposes, and optical communication systems, among other fields.

Lead Zirconate Sputter Target Packing

Our Lead Zirconate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

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TFM offers Lead Zirconate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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