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Lithium Oxide Sputtering Targets

ST0874 Lithium Borate Sputtering Target, Li2B4O7

Chemical Formula: Li2B4O7
Catalog Number: ST0874
CAS Number: 12007-60-2
Purity: 99.9% ~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Borate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Borate Sputtering Target Description

Lithium

Lithium borate sputtering target, also known as lithium tetraborate sputter target, is an inorganic compound with the formula Li₂B₄O₇.

Lithium is a chemical element derived from the Greek word ‘lithos,’ meaning stone. It was first identified in 1817 by A. Arfwedson and later isolated by W. T. Brande. Its chemical symbol is “Li,” and it has an atomic number of 3, located in Period 2, Group 1 of the periodic table, within the s-block. The relative atomic mass of lithium is 6.941(2) Dalton, with the number in parentheses indicating the uncertainty.

Related: Lithium Sputtering Target

Boron

Boron is a chemical element named after the Arabic word ‘buraq,’ which referred to borax. Its chemical symbol is “B.” Boron is the third most abundant element in the Earth’s crust. It plays a crucial role in enhancing the hardenability of steel, allowing for increased hardenable size and improved uniformity in microstructure and properties after quenching.

Related: Boron Sputtering Target

Lithium Borate Sputtering Target Specification

Material TypeLithium Borate
SymbolLi2B4O7
Color/AppearanceWhite Solid
Molecular Weight169.12
Density2.4 g/cm3
Melting Point917 °C
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Borate Sputtering Target Packing

Our Lithium Borate Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage that might occur during storage or transportation.

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TFM offers Lithium Borate  Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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