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Lithium Oxide Sputtering Targets

ST0875 Lithium Carbonate Sputtering Target, Li2CO3

Chemical Formula: Li2CO3
Catalog Number: ST0875
CAS Number: 554-13-2
Purity: 99.9% ~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Carbonate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Carbonate Sputtering Target Description

Lithium

Lithium Carbonate Sputtering Target is a white sputter target with the formula Li₂CO₃. It is widely used in the processing of metal oxides.

Lithium is a chemical element derived from the Greek word ‘lithos,’ meaning stone. It was first identified in 1817 by A. Arfwedson and later isolated by W. T. Brande. The chemical symbol for lithium is ‘Li.’ It has an atomic number of 3 and is located in Period 2, Group 1 of the periodic table, belonging to the s-block. Lithium’s relative atomic mass is 6.941(2) Dalton, with the number in brackets indicating the uncertainty.

Related: Lithium Sputtering Target

CarbonCarbon is a chemical element named after the Latin word ‘carbo,’ meaning charcoal. The chemical symbol for carbon is ‘C.’ It has a hexagonal crystal structure with numerous parallel layers. In each layer, carbon atoms are arranged at the corners of regular hexagons, forming an ordered three-dimensional arrangement. Carbon exhibits excellent electrical and thermal conductivity, chemical stability, and lubricity.

Related: Carbon Sputtering Target

Lithium Carbonate Sputtering Target Specification

Material TypeLithium Carbonate
SymbolLi2CO3
Color/AppearanceWhite Solid
Molecular Weight73.9
Density2.11 g/cm3
Melting Point723 °C
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Carbonate Sputtering Target Packing

Our Lithium Carbonate Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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TFM offers Lithium Carbonate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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