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ST0163D Lithium Nickel Manganese Cobalt Oxide Sputtering Target (LiNi0.33Mn0.33Co0.33O2)

MSDS File
Material Type Lithium Nickel Manganese Cobalt Oxide
Symbol LiNi0.33Mn0.33Co0.33O2
Color/Appearance Black, Solid
Melting Point (°C) N/A
Theoretical Density (g/cc) 4.80
Water Solubility Insoluble
Sputter RF, RF-R, DC
Max Power Density*
(Watts/Square Inch)		 N/A
Type of Bond Indium, Elastomer

Lithium Nickel Manganese Cobalt Oxide Sputtering Targets

Overview

Lithium Nickel Manganese Cobalt Oxide sputtering targets (LiNi₀.₃₃Mn₀.₃₃Co₀.₃₃O₂), commonly known as NMC sputtering targets, are high-performance materials used in semiconductor, CVD, PVD, display, and optical applications. Their unique composition allows them to be utilized in a variety of advanced thin film deposition processes, providing high-quality coatings and films with precise control over the material properties.

Lithium Nickel Manganese Cobalt Oxide Sputtering Targets Information

  • Purity: 99.9%
  • Circular: Diameter ≤ 14 inch, Thickness ≤ 15 mm
  • Block: Length ≤ 120 ±0.1 mm, Width ≤ 120 ±0.1 mm, Thickness ≤ 15 mm

More Information on Lithium Nickel Manganese Cobalt Oxide Sputtering Targets

Applications

  • Semiconductor Manufacturing
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)
  • Display & Optical Applications

Features

  • High Density: Provides robust performance and stability in sputtering applications.
  • Stoichiometric Composition: Ensures accurate film deposition with consistent properties.
  • Electrically Conductive at Room Temperature: Suitable for various electrical applications and processes.
  • Phase Pure: Guarantees the deposition of high-quality, phase-pure thin films.

Manufacturing Process

  • In-House Powder Synthesis: High-purity metal oxide precursor materials are synthesized with high-energy mixing and particle sizing.
  • Multiple Step Densification: Proprietary processes are employed for pressing and sintering to achieve optimal density and material properties.
  • Cleaning & Final Packaging: Targets are cleaned to meet vacuum use standards and carefully packaged to prevent contamination during shipment.

Options Available

  • 99.9% Minimum Purity: Ensures high-quality material for critical applications.
  • Custom Compositions: May be available upon request to meet specific needs.
  • Smaller Sizes for R&D: Available for research and development applications to support experimentation and innovation.
  • Sputtering Target Bonding Service: Target bonding services are offered to enhance stability and performance.

For further information or inquiries, please reach out to us directly.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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