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ST0163F Lithium Nickel Phosphate Sputtering Targets (LiNiPO4)

Lithium Nickel Phosphate Sputtering Target

Introduction

Lithium Nickel Phosphate Sputtering Target is a specialized ceramic target material designed for thin film deposition in advanced energy and electronic applications. With its unique lithium–nickel–phosphorus chemistry, this material enables the deposition of films with tailored electrochemical and electronic properties. Researchers and industrial users alike value it for fabricating thin-film battery components, functional coatings, and next-generation energy storage devices.

Detailed Description

Lithium Nickel Phosphate (LiNiPO₄) sputtering targets are typically manufactured through high-temperature solid-state synthesis and sintering, resulting in a dense, stable ceramic body suitable for sputtering. The targets are available in standard and custom geometries (circular, rectangular, or planar) to fit different deposition systems.

Key features include:

  • High Purity (≥99.9%): Essential for minimizing contamination and ensuring reproducible thin-film properties.

  • Homogeneous Microstructure: Provides uniform sputtering rates and film composition.

  • Stable Phosphate Framework: Enhances durability and reduces decomposition during sputtering.

  • Optional Bonding: Indium or elastomer bonding to a copper backing plate ensures reliable heat transfer and mechanical stability in high-power sputtering processes.

The combination of lithium and phosphate contributes to ionic conductivity, while nickel introduces redox-active sites, making the resulting thin films attractive for lithium-ion battery cathode research and related applications.

Applications

Lithium Nickel Phosphate Sputtering Targets are widely used in:

  • Thin Film Lithium-Ion Batteries – for solid-state cathode layers.

  • Energy Storage Devices – fabrication of next-generation rechargeable batteries.

  • Semiconductor R&D – research on functional oxide films.

  • Optical and Functional Coatings – development of phosphate-based films for electronic and photonic devices.

  • Material Science Research – studies on ionic conductivity, stability, and electrochemical performance.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures reliable thin film performance
Density≥ 95% of theoreticalImproves film uniformity
Diameter25 – 150 mm (customizable)Fits various sputtering systems
Thickness3 – 10 mmInfluences deposition stability
BondingIndium / Elastomer / Copper backingEnhances thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Lithium Nickel PhosphateHigh energy density & ionic stabilityThin film batteries, energy R&D
Lithium Cobalt Oxide (LCO)Established cathode materialConsumer electronics
Lithium Iron Phosphate (LFP)Excellent thermal stabilityPower storage, EV batteries

FAQ

QuestionAnswer
Can Lithium Nickel Phosphate targets be customized?Yes, we can tailor size, thickness, purity, and bonding.
What packaging is used?Targets are vacuum-sealed with protective cushioning, shipped in export-safe cartons or wooden crates.
Which industries benefit most from this material?Energy storage, thin film battery R&D, semiconductors, and advanced material research.
Does the target require special storage?Yes, store in dry, moisture-free conditions to prevent lithium degradation.
Can it be bonded to a backing plate?Yes, indium or copper bonding is available for high-power sputtering systems.

Packaging

Each Lithium Nickel Phosphate Sputtering Target is carefully vacuum-packed and externally labeled to ensure easy identification and safe handling. Shock-absorbing foam and export-grade packaging are used to prevent damage during storage and transit, ensuring the targets arrive in excellent condition.

Conclusion

Lithium Nickel Phosphate Sputtering Target is an advanced material tailored for thin film deposition in battery research, semiconductors, and functional coatings. With its high purity, stable structure, and customizable options, it offers researchers and industrial users a reliable pathway to developing next-generation electrochemical devices.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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