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ST0163F Lithium Nickel Phosphate Sputtering Targets (LiNiPO4)

MSDS File
Material TypeLithium Nickel Phosphate
SymbolLiNiPO4
Color/AppearanceWhite, Solid
Melting Point (°C)~600
Theoretical Density (g/cc)N/A
Water SolubilityLow
SputterRF, RF-R, DC
Max Power Density*
(Watts/Square Inch)		N/A
Type of BondIndium, Elastomer
Comments

Lithium Nickel Phosphate Sputtering Targets

Lithium Nickel Phosphate (LiNiPO₄) sputtering targets are specialized materials used in the production of high-quality thin films for various advanced applications. These targets are primarily utilized in energy storage systems, lithium-ion batteries, and catalysis for industries requiring high-performance materials.

Specifications

  • Purity: 99.9%

  • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm

  • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Key Features and Advantages

  • High Purity: TFM’s Lithium Nickel Phosphate sputtering targets are made with a purity of 99.9%, ensuring high-quality deposition and superior thin films that meet stringent industry standards.

  • Custom Sizes Available: These targets are available in custom sizes to accommodate specific requirements for R&D or large-scale production.

  • Uniform Film Deposition: The cold-pressed and sintered manufacturing process ensures consistent and uniform deposition for precision thin films.

  • Durability and Performance: The elastomer bonding of the target to the backing plate enhances the strength and resilience during sputtering, ensuring optimal performance over time.

  • Vacuum Compatible: The targets are carefully cleaned and packaged, making them ideal for use in vacuum deposition processes and ensuring protection from environmental contaminants.

Applications

  • Lithium-Ion Batteries: Lithium Nickel Phosphate is a vital material for developing high-performance lithium-ion batteries. The films produced from these sputtering targets can be used in electrodes, offering high energy density and long cycle life.

  • Energy Storage: Used in energy storage systems, these targets contribute to creating materials that store and release energy efficiently, especially in electric vehicles and renewable energy applications.

  • Catalysis: The unique properties of Lithium Nickel Phosphate make it suitable for use in various catalytic applications, particularly in fuel cells and hydrogen production processes.

  • Electronics: The high-quality thin films produced with Lithium Nickel Phosphate are also used in electronic components where precise and reliable performance is needed.

Manufacturing Process

  • Cold-Pressed and Sintered: The sputtering targets undergo a cold-pressing and sintering process to achieve uniform density and consistency, which ensures efficient and reliable thin film deposition.

  • Elastomer Bonding: The elastomer bonding process securely attaches the sputtering target to its backing plate, enhancing durability and ensuring long-lasting performance.

  • Cleaning and Packaging: TFM ensures that all sputtering targets are thoroughly cleaned and securely packaged to avoid contamination and ensure they are ready for vacuum deposition applications.

Available Options

  • 99.9% Purity: TFM offers these targets with a minimum purity of 99.9% to ensure consistent and high-quality deposition in critical applications.

  • Custom Sizes: Custom-sized sputtering targets are available for unique research and development projects, providing flexibility for both small-scale and large-scale applications.

  • R&D Applications: Smaller sizes are available for research and development (R&D) purposes, catering to experimental and prototype applications.

  • Sputtering Target Bonding Service: TFM provides bonding services to enhance the performance of the sputtering targets, ensuring a secure attachment to the backing plate for optimal results.

Conclusion

TFM’s Lithium Nickel Phosphate Sputtering Targets are ideal for lithium-ion battery production, energy storage applications, and catalytic processes. The high purity, customizable sizes, and reliable manufacturing process ensure high-performance and consistent results for thin film deposition in various advanced technologies. Whether for research, development, or industrial production, these targets provide the high quality and versatility needed for innovative applications.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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