Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
1-2010291A501429-removebg-preview

ST0163E Lithium Nickel Vanadium Oxide Sputtering Targets (LiNiVO4)

Material TypeLithium Nickel Vanadium Oxide
SymbolLiNiVO4
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Relative Density (g/cc)>90%
Z RatioN/A
SputterRF, RF-R, DC
Max Power Density*
(Watts/Square Inch)		N/A
Type of BondIndium, Elastomer

Lithium Nickel Vanadium Oxide Sputtering Targets

Overview

Lithium Nickel Vanadium Oxide (LiNiVO₃) sputtering targets are specialized materials used in high-performance applications such as high voltage cathode composites, rechargeable lithium cells, electric vehicles, and small cell applications. With a high purity of 99.9%, these targets provide consistent, reliable performance for semiconductor and thin-film deposition processes.

Lithium Nickel Vanadium Oxide Sputtering Targets Information

  • Purity: 99.9%
  • Circular: Diameter ≤ 8 inch, Thickness ≥ 1 mm
  • Block: Length ≤ 16 inch, Width ≤ 8 inch, Thickness ≥ 1 mm

More Information on Lithium Nickel Vanadium Oxide Sputtering Targets

Applications

  • High Voltage Cathode Composites
  • Cathode Material for Rechargeable Lithium Cells
  • Electric Vehicles
  • Small Cell Applications

Features

  • High Purity: Ensures optimal performance and minimal contamination.
  • High Density: Relative density ≥85%, providing robust and stable material properties.
  • Single Phase: Guarantees phase-pure deposition for high-quality thin films.
  • Custom Sizes Available: Can be tailored to meet specific application requirements.

Manufacturing Process

  • In-House Powder Synthesis: High-purity metal oxide precursor materials undergo high-energy mixing and particle sizing processes to achieve ideal composition.
  • Multiple Step Densification: Proprietary pressing and sintering methods are used for optimal density and material characteristics.
  • Cleaning & Final Packaging: Targets are cleaned for vacuum use and carefully packaged to protect from environmental contaminants and during shipment.

Options Available

  • 99.9% Minimum Purity: For critical applications that demand high-quality materials.
  • Smaller Sizes for R&D: Available for research and development applications.
  • Sputtering Target Bonding Service: Optional bonding service for improved target stability and performance.

For more information or to place an order, please contact us.

XRD Chart of Lithium Nickel Vanadium Oxide Sputtering Targets

Reviews

There are no reviews yet.

Be the first to review “ST0163E Lithium Nickel Vanadium Oxide Sputtering Targets (LiNiVO4)”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top