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ST0172 Lithium Niobate Sputtering Target, LiNbO3

Chemical Formula: LiNbO3
Catalog Number: ST0172
CAS Number: 12031-63-9
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

LiNbO3 (Lithium Niobate) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Niobate Sputtering Target Description

LithiumniobiumThe Lithium Niobate Sputtering Target from TFM contains lithium (Li), niobium (Nb), and oxygen (O). Lithium niobate (LiNbO3) is a synthetic compound known for its single crystals, which are crucial in various optical and electronic applications. This material is widely used in optical waveguides, mobile phones, piezoelectric sensors, and optical modulators, among other linear and non-linear optical applications. As a human-made dielectric material, lithium niobate does not occur naturally and is sometimes referred to by the brand name “linobate.” Its unique properties make it invaluable in advanced technological applications, particularly in the field of optics and telecommunications.

Related Product: Lithium Sputtering Target

Lithium Niobate Sputtering Target Specification

Material TypeLithium Niobate
SymbolLiNbO3
Color/AppearanceWhite, Crystalline Solid
Melting PointN/A
Density 4.638 g/cm3
SputterRF, RF-R
Type of BondIndium, Elastomer
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Lithium Niobate Sputtering Target Applications

The Lithium Niobate Sputtering Target is widely used for thin film deposition, particularly in applications such as fuel cells, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also utilized in glass coating technologies. In the telecommunications market, lithium niobate is extensively employed in mobile phones and optical modulators. Additionally, it plays a crucial role in laser frequency doubling, nonlinear optics, Pockels cells, optical parametric oscillators, Q-switching devices for lasers, acousto-optic devices, and optical switches operating at gigahertz frequencies. Its versatility and effectiveness in these applications make it a valuable material in both electronics and optics industries.

Lithium Niobate Sputtering Target Bonding Service

Specialized bonding services for Lithium Niobate Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Our LiNbO3 (Lithium Niobate) sputtering targets are meticulously tagged and labeled externally to ensure efficient identification and maintain stringent quality control. We take great care to prevent any damage during storage and transportation, ensuring that the targets arrive in excellent condition and retain their high quality for optimal performance in various applications.

Get Contact

TFM offers LiNbO3 (Lithium Niobate) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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