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ST0173 Lithium Phosphate Sputtering Target, Li3PO4

Chemical Formula: Li3PO4
Catalog Number: ST0173
CAS Number: 10377-52-3
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Phosphate  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Phosphate Sputtering Target Description

LithiumLithium is a chemical element with the symbol “Li,” originating from the Greek word ‘lithos,’ meaning stone. It was first mentioned and observed by A. Arfwedson in 1817, with its isolation later accomplished and announced by W. T. Brande. Lithium has an atomic number of 3 and is located in Period 2, Group 1 of the periodic table, within the s-block. Its relative atomic mass is 6.941(2) Dalton, with the number in brackets indicating the measurement uncertainty. Lithium is widely used in rechargeable batteries, especially for electronic devices and electric vehicles, due to its high electrochemical potential and low density. It is also used in the manufacture of ceramics, glass, and as a medication for bipolar disorder.

Related Product: Lithium Sputtering Target

PhosphorusPhosphorus is a chemical element named after the Greek word ‘phosphoros,’ meaning bringer of light. It was first mentioned and observed by H. Brand in 1669, who also accomplished its isolation. The chemical symbol for phosphorus is “P,” and its atomic number is 15. Phosphorus is located in Period 3, Group 15 of the periodic table, within the p-block. Its relative atomic mass is 30.973762(2) Dalton, with the number in brackets indicating the measurement uncertainty. Phosphorus is essential for life, playing a key role in the structure of DNA and RNA, as well as in the production of ATP, which provides energy to cells. It is also widely used in fertilizers, detergents, and in various industrial processes.

OxygenOxygen is a chemical element with the symbol “O,” derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. Oxygen has an atomic number of 8 and is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is a vital element for life, essential for respiration in most organisms, and is a key component in water, organic compounds, and various industrial processes including combustion and oxidation reactions.

Lithium Phosphate Sputtering Target Handling Notes

  • Elastomer Bonding: Elastomer bonding is recommended for the lithium phosphate sputtering target due to its brittleness and low thermal conductivity, which make it less suitable for traditional sputtering methods.
  • Thermal Conductivity: This material has low thermal conductivity and is susceptible to thermal shock. Proper bonding and handling techniques are essential to prevent damage during the sputtering process.

Lithium Phosphate Sputtering Target Packaging

Our Lithium Phosphate Sputter Targets are meticulously handled to prevent any damage during storage and transportation, ensuring the preservation of their quality in their original condition. We implement strict handling and packaging protocols to maintain the integrity and performance of our products.

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TFM offers Lithium Phosphate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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